High-efficiency CPU (central processing unit) radiator

A radiator and high-efficiency technology, used in instruments, electrical digital data processing, digital data processing components, etc., can solve the problems of insufficient heat dissipation, low heat dissipation efficiency, and large size, and achieve compact structure and heat dissipation efficiency. high, good effect

Inactive Publication Date: 2015-01-14
NANJING DOMIN ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But in this way, the heat dissipation has not been effectively improved, and sometimes it will be reduced.
Therefore, the current desktop CPU radiators basically have the disadvantages of large size, heavy weight, high price and low heat dissipation efficiency.

Method used

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  • High-efficiency CPU (central processing unit) radiator

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Embodiment Construction

[0026] The technical solutions provided by the present invention will be described in detail below in conjunction with specific examples. It should be understood that the following specific embodiments are only used to illustrate the present invention and are not intended to limit the scope of the present invention.

[0027] Such as figure 1 Shown is a schematic structural diagram of the present invention, which is a high-efficiency CPU radiator, including a CPU socket 1 and a CPU fixing plate.

[0028] The CPU socket 1 is in the shape of a cube, and its inner edge is provided with a heat dissipation channel 2 of the socket; and the CPU socket 1 is uniformly provided with socket holes 3 along the vertical direction.

[0029] The CPU fixing plate includes cooling fins 4 , electronic cooling fins 5 , cooling tubes 6 and radiators 7 .

[0030] The electronic cooling plate 5 is closely fixed to the radiator 7; the edge of the radiator 7 is fixed horizontally around the connection...

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Abstract

The invention provides a high-efficiency CPU (central processing unit) radiator which comprises a CPU insertion connecting seat and a CPU fixing plate. The CPU insertion connecting seat is cubic, an insertion connecting seat radiating passage is arranged at the inside edge of the CPU insertion connecting seat, the CPU insertion connecting seat is provided with insertion connecting holes along the vertical direction in a uniformly penetrating manner, the CPU fixing plate comprises a cooling piece, an electronic refrigerating piece, a cooling pipe and a radiator, the electronic refrigerating piece and the radiator are fixed in an appressed manner, the cooling piece and the electronic refrigerating piece are fixed, corresponding edges of the cooling piece are symmetrically connected with cooling fins, the cooling pipe is connected with the edge of the cooling piece and wraps the cooling fins, and one end of the refrigerating pipe is fixed to one side of the cooling piece while the other end of the same penetrates the insertion connecting seat radiating passage to be fixed to the other side of the cooling piece. The high-efficiency CPU radiator has the advantages of compact structure, small size, high radiating efficiency and good effect, has both an air cooling effect and a wind cooling effect and can maintain low-temperature effect inside a cabinet.

Description

technical field [0001] The invention belongs to the field of heat dissipation equipment for electronic devices, and in particular relates to a high-efficiency CPU radiator for desktop computers with simple structure, compact structure and high heat dissipation efficiency. Background technique [0002] The CPU is a very large-scale integrated circuit, which is the computing core and control core of a computer. With the continuous development of the computer, the CPU is also constantly updated, and the number of transistors in the CPU is continuously increasing; the heat generation of the device is also increasing. In order to ensure the good operating efficiency of the computer, it is necessary to ensure the heat dissipation efficiency of the CPU. [0003] In the heat transfer process of the radiator, the air convection heat transfer thermal resistance is the largest; and the current desktop CPU radiator blindly increases the size of the heat sink area and the size and n...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 杨森朱士建
Owner NANJING DOMIN ELECTRONICS EQUIP
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