Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Resist adhesion improver and method for producing copper wiring line

An adhesion and resist technology, which can be used in the manufacture of printed circuits, semiconductor/solid-state device manufacturing, and removal of conductive materials by chemical/electrolytic methods, which can solve problems such as not helping to improve the adhesion of resist films. , to achieve the effect of improving the adhesion and reducing the amount of side erosion

Inactive Publication Date: 2014-12-24
NAGASE CHEMTEX CORPORATION
View PDF10 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] As a result of the study by the present inventors, it can be seen that when a photosensitive resist film is formed on a substrate after surface treatment of the copper film using such a cleaning solution, there is almost no difference in the amount of undercut during etching and when the surface treatment is not performed. Therefore, it does not help to improve the adhesion of the resist film on the copper surface

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Resist adhesion improver and method for producing copper wiring line
  • Resist adhesion improver and method for producing copper wiring line
  • Resist adhesion improver and method for producing copper wiring line

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0046] Hereinafter, the present invention will be described more specifically by way of examples, but the following description is mainly for illustration, and the present invention is not limited to these examples.

[0047] Table 1 shows the composition of each evaluation liquid used in Examples 1-19, and Table 2 shows the composition of each evaluation liquid used in Comparative Examples 1-20. In addition, the following evaluations were performed using these evaluation liquids, and the results are shown.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A resist adhesion improver which contains 1.5-20% by weight of an organic acid, 0.0007-0.73% by weight of chloride ions and 0.00003-3.7% by weight of ammonium ions, with the balance made up of water, and wherein the molar concentration ratio of the chloride ions to the ammonium ions is within the range of 0.1-10; and a method for producing a copper wiring line, wherein when a photosensitive resist film is formed on a copper film, the copper film surface is processed using the resist adhesion improver and then the photosensitive resist film is formed on the copper film. Consequently, adhesion of the photosensitive resist to the copper film surface is improved.

Description

technical field [0001] The resist adhesion improving agent and the copper wiring manufacturing method according to the present invention utilize the copper wiring formed from the copper film on the surface of the substrate in the manufacture of display devices such as liquid crystal displays (LCD) and electroluminescent (EL) displays. When forming a resist film on the surface of the copper film, the line step is suitable for surface treatment of the copper film to improve the adhesion between the resist film and the surface of the copper film. Background technique [0002] In high-performance LCD and EL displays, copper is beginning to be used as a wiring material instead of aluminum. The reason why copper is preferable is that it has a lower resistivity than aluminum and can miniaturize the wiring, so it has advantages such as wide design of openings and high-speed driving of switches. [0003] As a method of manufacturing copper wiring, the following method is generally u...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C23G1/10C23F1/00G03F7/09H01L21/027
CPCC23C22/52G03F7/16H05K3/06H05K2203/0392H05K2203/0789
Inventor 吉崎了武井瑞树安江秀国
Owner NAGASE CHEMTEX CORPORATION
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com