Inflation purification system of wafer/photomask sealed carrier

Abstract

The invention discloses an inflation purification system of a wafer / photomask sealed carrier, and particularly relates to an inflation purification system, with controllable gas inflow rate and high cleanliness effect, of the wafer / photomask sealed carrier. The system comprises at least one inflation module, a gas supply module, an exhaust module and a processing module, wherein at least one gas inflow valve connected with the gas supply module and at least one exhaust valve connected with the exhaust module are arranged on the inflation module, a flow regulating valve and a pressure flow meter are respectively arranged on the portion, between the gas supply module and the gas inflow valve, of a gas inflow loop, and the flow regulating valve is connected to the processing module. Thus, when the carrier is placed on the inflation module for inflation, the gas supply condition of the gas inflation module can be detected, known and displayed through the processing module, the flow and the pressure of the inflation module are regulated according to the actual condition so that inflation of the carrier can be fast completed, the inflow and outflow stability of clean gas in the carrier is kept, and the internal cleanliness of the carrier is effectively improved.

Description

technical field [0001] The present invention relates to the technical field of inflating a wafer / reticle sealed carrier, in particular to an inflatable purification system for a wafer / wafer / reticle sealed carrier that can effectively control and manage the inflation state , in order to achieve the effect of increasing wafer yield, increasing production volume and reducing cost. Background technique [0002] Electronic products are constantly developing towards characteristics such as lightness, thinness, high frequency, and high performance. To meet this product development direction, the core chips used in electronic products must be miniaturized and have high performance. For high performance, it is necessary to miniaturize the wire diameter of the integrated circuit on the chip. Affected by the miniaturization of integrated circuits and the cost of manufacturing, the size of wafers is getting larger and larger, but the number of chips per wafer is increasing, which makes...

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Problems solved by technology

[0009] In order to solve the above-mentioned technical problems, the present invention provides an air-inflating purification system for a wafer / reticle sealed carrier, so as to overcome the problem that the existing ones cannot maintain cleanliness for a long time, and further increase the efficiency of air-inflation management

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