Laser weldable aluminum based composite material and preparation method thereof

An aluminum-based composite material and laser welding technology, which is applied in the field of aluminum-based composite material preparation, can solve the problem that the connection strength and the air tightness of the package cannot meet the requirements, the hot extrusion or hot forging deformation processing cannot be performed, and the substrate and the chip cannot be formed. There are no problems such as mechanical protection, so as to achieve the effects of easy engineering, high utilization of raw materials, and small fluctuations in mechanical performance data.

Active Publication Date: 2014-12-17
南京驰韵科技发展有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The internal pores of the material will cause serious welding porosity problems in the laser welding process. The welding porosity will cause the connection strength and packaging airtightness to fail to meet the requirements; Shell parts cannot withstand the stress and deformation caused by machining, fusion welding and brazing processes, so they cannot provide long-term effective mechanical protection for substrates and chips
[0005] Typical silicon particle-reinforced aluminum-based composite materials for packaging are medium / high volume composite materials. Due to the high content of brittle reinforcing particles and poor material plasticity, these materials are basically unable to be deformed by hot extrusion or hot forging. The materials can only rely on Preparation process achieves tissue densification

Method used

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  • Laser weldable aluminum based composite material and preparation method thereof
  • Laser weldable aluminum based composite material and preparation method thereof
  • Laser weldable aluminum based composite material and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0029] Example 1: Preparation of 90kg50wt%Si / Al aluminum-based composite material:

[0030] (1) Weigh 45kg of silicon powder with an average particle size of 5.5μm and 45kg of aluminum alloy powder with an average particle size of 4.6μm;

[0031] (2) Put the silicon powder and aluminum alloy powder weighed according to step (1) and 90kg of stainless steel balls into a conical mixing tank for mixing for 30 hours to obtain a uniform Si / Al powder mixture; the speed of the mixer is 50r / min;

[0032] (3) Put the Si / Al powder mixture prepared in step (2) into a rubber sheath with a size of φ380mm×H645mm and cold isostatically press it into a cold isostatic pressed ingot with a relative density of 69%; The static pressure is 200MPa, and the holding time is 15min;

[0033] (4) Put the cold isostatic pressed ingot prepared in step (3) into an aluminum sheath with a size of φ340mm×H580mm for vacuum degassing treatment; the method is as follows: the vacuum value inside the aluminum she...

Embodiment 2

[0036] Embodiment 2: Prepare the aluminum-based composite material of 50kg27wt%Si / Al:

[0037] (1) Weigh 13.5kg of silicon powder with an average particle size of 9.2μm and 36.5kg of aluminum alloy powder with an average particle size of 8.8μm;

[0038] (2) Put the silicon powder and aluminum alloy powder weighed according to step (1) and 40kg of stainless steel balls into a conical mixing tank for mixing for 24 hours to obtain a uniform Si / Al powder mixture; the speed of the mixer is 80r / min;

[0039] (3) Put the Si / Al powder mixture prepared in step (2) into a rubber sheath with a size of φ280mm×H630mm and cold isostatically press it into a cold isostatic pressed billet with a relative density of 74%; cold etc. The static pressure is 150MPa, and the holding time is 10min;

[0040] (4) Put the cold isostatic ingot prepared in step (3) into an aluminum sheath with a size of φ248mm×H570mm for vacuum degassing treatment; the method is as follows: the vacuum value inside the al...

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Abstract

Belonging to the technical field of preparation of aluminum based composite materials, the invention especially relates to a laser weldable aluminum based composite material and a preparation method thereof. The method provided by the invention includes: mixing silicon powder and aluminum powder according to a proportion in a mixing tank uniformly to obtain a powder mixture, and subjecting the powder mixture to cold isostatic pressing, high temperature and high vacuum degassing, and hot isostatic pressing densification treatment, thus obtaining the 100% compact, and internally imporous Si/Al composite billet. The method provided by the invention has the advantages of simple and stable process and low cost, and is one of the preferred methods for preparation of preparation of high reliability and stable quality packaging materials. The Si/Al composite material prepared by the method not only has the characteristics of light weight, low expansion and high thermal conductivity, but also has high and stable mechanical properties, especially has the characteristics of good laser welding technological properties and high air tightness, thus being an advanced aluminum based composite material with an integrated functional structure. And the material can be applied as a hermetic encapsulation shell for microelectronic devices and photoelectric devices.

Description

technical field [0001] The invention belongs to the technical field of preparation of aluminum-based composite materials, and in particular relates to a laser-weldable aluminum-based composite material and a preparation method thereof. Background technique [0002] Microcircuit components of current electronic equipment are gradually developing in the direction of small size and light weight, high operating frequency, high power density, high integration and high reliability. As an important part of microcircuit components, the metal package shell plays an important role in mechanical support, heat dissipation channel, signal transmission, chip and substrate protection, etc., which requires the package shell material to have high thermal conductivity (chip heat dissipation) and low thermal expansion coefficient (Matched with the ceramic substrate to reduce thermal stress), excellent airtightness (meet the requirements of component hermetic packaging), good machining and conn...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C21/02C22C29/18C22C1/05
Inventor 刘彦强樊建中熊柏青马自力魏少华左涛
Owner 南京驰韵科技发展有限公司
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