Laser-tig composite wire sealing welding method for L-shaped aluminum alloy structure

Abstract

The invention discloses a laser-TIG composite wire filling seal welding method for an L-shaped aluminum alloy structure. The method comprises the steps that aluminum alloy is fixed in a gapless mode according to an L-shaped structure before welding, and a V-shaped groove is formed in the outer side of the L-shaped aluminum alloy structure after fixing; a laser, a TIG weld gun and a wire feed nozzle are elevated at the same time during welding, the outer side of the L-shaped aluminum alloy structure is horizontally placed, welding technology parameters of a first layer and a second layer are controlled to be the same, welding technology parameters of layers from a third layer to the last layer are controlled to be the same, and wire filling welding is carried out on a fourth layer and a fifth layer; after the outer side is welded, the inner side of the L-shaped aluminum alloy structure is placed upwards by 45 degrees, and wire filling welding is carried out on the fifth layer and a sixth layer. Multi-layer wire filling is carried out, the interlayer temperature and the laser defocusing amount are accurately controlled, and therefore the deformation, caused by excessively large thermal input, of the L-shaped structure is avoided to the greatest extent; the inner side and the outer side are welded in sequence, the deformation tendency in the welding process is restrained to the greatest extent, and the laser-TIG composite wire filling sealing welding efficiency is guaranteed.

Description

technical field [0001] The invention belongs to the technical field of welding and forming of aluminum alloys used in the integrated circuit industry, and relates to a laser-TIG composite wire sealing welding method for an L-shaped aluminum alloy structure. It is suitable for thick plate aluminum alloy materials, multi-layer double-sided sealing welding of composite wire filling. Background technique [0002] In recent years, with the rapid development of the integrated circuit equipment manufacturing industry, the role and status of many large and medium-thick aluminum alloy parts in IC equipment and other semiconductor equipment have become increasingly prominent. At present, most of the aluminum alloy cavity structures in integrated circuit equipment adopt integral The whole block blank is milled and removed, the material utilization rate is extremely low, the manufacturing cycle is long, and the precision of the formed cavity structure is low. Subsequent processing is re...

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Problems solved by technology

[0003] In order to solve the problems caused by the current laser-TIG composite wire sealing welding process of semiconductor equipment L-shaped aluminum alloy structure, the present invention provides a laser-TIG composite wire sealing welding method for L-shaped aluminum alloy structure, which uses laser -TIG composite wire-filled sealing welding is performed on 10-15mm thick aluminum alloys for multi-layer wire-filled welding, using small laser and small TIG current line energy density input to achieve stable, small heat-affected zone, high-density and high-precision aluminum alloys Laser-TIG Composite Filler Seal Welding of L-shaped Structure

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