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Fine-line PCB manufacturing method

A technology of fine lines and production methods, which is applied in the direction of removing conductive materials by chemical/electrolytic methods, and can solve the problems of fine line side erosion and excessive side erosion of fine lines, so as to reduce the amount of side erosion, ensure production quality, Avoid the effect of collapse

Inactive Publication Date: 2014-12-03
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims at the problem of serious side erosion of fine lines in the production of existing fine line PCBs, and provides a production method that can avoid excessive side erosion of fine lines and improve the quality of fine line PCBs

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] A method for manufacturing a fine circuit PCB provided in this embodiment includes the following steps:

[0021] (1) Lay the inner layer circuit board, prepreg and copper foil with a thickness of 2OZ in sequence according to the requirements, and put the smooth side of the copper foil inward and the rough side outward, that is, the smooth side of the copper foil faces the prepreg to form a stack Plywood.

[0022] Then the laminated boards are moved into a press furnace and pressed together by a hot pressing process to form a multi-layer board. During the hot pressing process, the temperature and pressure gradually change with time as shown in the table below, and the total time is 280 minutes:

[0023] temperature

140

165

185

210

195

195

195

175

140

140

pressure

50

250

250

400

400

400

200

200

100

100

time

8

7

9

40

15

70

30

20

18 ...

Embodiment 2

[0033] A conventional manufacturing method of a fine circuit PCB provided in this embodiment includes the following steps:

[0034] (1) Lay the inner layer circuit board, prepreg and copper foil with a thickness of 0.25OZ (the thinnest copper foil in the industry) in order according to the requirements, and put the rough side of the copper foil inward and the smooth side outward, that is, copper The matte side of the foil faces the prepreg to form a laminate.

[0035] Then the laminated boards are moved into a press furnace and pressed together by a hot pressing process to form a multi-layer board. During the hot pressing process, the temperature and pressure gradually change with time as shown in the table below, and the total time is 280 minutes:

[0036] temperature

140

165

185

210

195

195

195

175

140

140

pressure

50

250

250

400

400

400

200

200

100

100

time

8

7...

Embodiment 3

[0045]This embodiment is basically the same as Embodiment 1, except that the thickness of the copper foil used in the step (1) of this embodiment is 3OZ.

[0046] Using copper foil with 3OZ copper thickness, the drill tip will be damaged during the drilling process, and the life of the drill tip will be shortened, and the production cost of the fine line PCB will increase due to the thicker copper foil.

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PUM

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Abstract

The invention relates to the technical field of PCB manufacturing, in particular to a fine-line PCB manufacturing method. The fine-line PCB manufacturing method sequentially comprises a press-fit step, a drilling step, a copper foil removal step, a copper deposition step, a step of transferring an outer layer image, a pattern plating step, a micro-etching step and a common back-end work procedure. Outer layer copper foil arranged on a multi-layer board in a press-fit mode is removed, copper deposition is carried out on a prepreg layer, pattern manufacturing and pattern plating are directly carried out on a copper deposition layer, and press-fit of a copper foil layer is omitted, so that a base copper layer is thin, a micro-etching mode is adopted in the outer layer etching process, and therefore the phenomenon of serious lateral erosion of the two sides of a line is avoided. The lateral erosion quantity of the two sides of the line is less than 1 micrometer and is reduced by ten times or more compared with that of the existing manufacturing process, and the manufacturing quality of a fine-line PCB is guaranteed. The smooth surface of the copper foil and the prepreg are bonded together in a press-fit mode, the binding force between the copper foil and the prepreg is reduced, the copper foil and the prepreg are poorly bonded, as a result, the hole collapse problem can be avoided in the drilling process, and the copper foil can be torn off after the drilling step.

Description

technical field [0001] The invention relates to the technical field of PCB production and preparation, in particular to a method for manufacturing a fine circuit PCB. Background technique [0002] The PCB is a support for electronic components and provides electrical connections for electronic components. The production process of PCB is generally: material cutting → inner layer pattern transfer → inner layer etching → lamination → drilling → sinking copper → whole board plating → outer layer pattern transfer → pattern plating → etching → solder mask → surface treatment → forming processing etc. [0003] In recent years, with the continuous development of light, thin, short and small electronic products, PCBs are also gradually developing towards high density. Therefore, the circuit patterns on the PCB need to have higher precision and density, that is, fine lines. At present, the general steps of the production method are to drill holes on the laminated multi-layer board ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/06
Inventor 常文智姜雪飞彭卫红刘东
Owner SHENZHEN SUNTAK MULTILAYER PCB
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