A printed circuit board and its processing method
A technology for printed circuit boards and circuits, which is applied to printed circuit components, and removes conductive materials by chemical/electrolytic methods. It can solve problems that affect signal accuracy, side erosion, and inability to protect, so as to ensure accuracy. , avoid side erosion phenomenon, high quality effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0024] Embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0025] refer to figure 2 , the PCB processing method of the embodiment of the present invention mainly includes:
[0026] 201, covering the dry film 4 on the copper foil surface of the substrate 3, the copper foil surface includes the line area 5 and the non-line area for setting the line 1, and the non-line area includes the adjacent area 6 adjacent to the line area 5 and the surrounding area 7. Specifically, the circuit area 5, the adjacent area 6 and the surrounding area 7 on the copper foil surface can be as follows image 3 As shown, the structure formed after the substrate 3 covers the dry film 4 can be as follows Figure 4 shown;
[0027] 202. Perform opaque, partially transparent, and fully transparent exposure treatments on the dry film on the circuit area 5, the adjacent area 6, and the surrounding area 7 respectively. Specifically, the n...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com