Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

New Hybrid Integrated Circuits for Terahertz Mixers

A technology of hybrid integrated circuits and mixers, which is applied in the field of transmission devices for telecommunication, and can solve problems such as deviation from design results of mixers, inability to maintain consistent design accuracy in flip-chip welding, and deterioration of circuit performance.

Active Publication Date: 2017-02-01
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the very high operating frequency, the size of the Schottky diodes used is very small, ranging from tens of microns to hundreds of microns. The Schottky diodes need to be flip-chip welded on the quartz circuit board and require personnel with very high welding skills to complete. The related process is time-consuming and labor-intensive. However, since it can only be manually operated under a microscope, the accuracy of its flip-chip welding still cannot be consistent with the design accuracy, resulting in deterioration of circuit performance.
Due to errors such as diode displacement introduced during flip-chip soldering, the mixing loss of the mixer increases, and the actual test results of the mixer deviate from the design results.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • New Hybrid Integrated Circuits for Terahertz Mixers

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] The technical solutions in the embodiments of the present invention are clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0019] In the following description, a lot of specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, and those skilled in the art can do it without departing from the meaning of the present invention. By analogy, the present invention is therefore not limited to the specific examples disclosed below.

[0020] Such as figure ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a novel hybrid integrated circuit for terahertz mixers, and relates to the technical field of transmission devices for electric communication. The novel hybrid integrated circuit comprises quartz substrate circuits, a GaAs substrate circuit, a radio frequency waveguide and a local oscillation waveguide. The GaAs substrate circuit comprises a GaAs substrate and a GaAs terahertz Schottky diode disposed in the GaAs substrate. The front of the GaAs terahertz Schottky diode faces upward. The two ends of a GaAs terahertz Schottky diode pad are respectively integrated with a section of GaAs-based micro strip transmission line or suspended micro strip transmission line, and the GaAs-based micro strip transmission lines or the suspended micro strip transmission lines are respectively and electrically connected with the quartz substrate circuits on the two sides. The integrated circuit reduces the difficulty in device micro assembly. Compared with the current commonly-used hybrid integrated circuit form, the diode assembly precision is improved, the frequency conversion loss of mixers can be reduced, and the test result of mixers is enabled to be closer to the designed result.

Description

technical field [0001] The present invention relates to the technical field of transmission devices for electrical communication, in particular to a novel hybrid integrated circuit used for a terahertz mixer. Background technique [0002] In a broad sense, terahertz (THz) waves refer to electromagnetic waves with frequencies in the range of 0.1-10THz, where 1THz=1000GHz, and some people think that THz frequencies refer to electromagnetic waves in the range of 0.3THz-3THz. THz waves occupy a very special position in the electromagnetic spectrum, and THz technology is recognized as a very important cross-frontier field by the international scientific and technological community. The mixer in the terahertz frequency band is mainly sub-harmonic mixing, and its local oscillator frequency can be half of the RF frequency to be tested. Sub-harmonic mixing can reduce the requirements for local oscillator frequency. The most commonly used is sub-harmonic Mixer. [0003] Internationa...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H03D7/16
Inventor 王俊龙杨大宝邢东梁士雄张立森赵向阳冯志红
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products