Multi-stage evaporation micro-channel heat pipe heat transferring and radiating device

Abstract

The invention relates to a radiating device and discloses a multi-stage evaporation micro-channel heat pipe heat transferring and radiating device. The device comprises two independent working medium circulating systems, and each working medium circulating system is composed of a heat absorbing end and a radiating end; each heat absorbing end comprises at least one heat sink, each heat sink is connected with a condenser through a heat pipe, the condenser is correspondingly divided into several parts according to the number of the heat sinks connected with the condenser, and each part of the condenser and the corresponding heat pipe and the corresponding heat sink connected with the part of the condenser form a sealed independent working medium circulating space; each radiating end comprises an evaporator and a radiator, each evaporator is connected with the corresponding radiator to absorb heat and transfer the heat to the corresponding radiator through the corresponding heat pipe, each evaporator is the same as the condenser in structure, and the condenser, the evaporators and the radiators are provided with micro-channel structures. The heat sinks connected with heat sources and corresponding working medium circulating spaces are independent, a thermal coupling function is reduced, and by means of two-stage evaporation, heat conduction capacity can be greatly improved and flow resistance of fluids in the heat pipes can be greatly reduced.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a device that combines microchannels and heat pipes and adopts multi-stage evaporation to dissipate heat from multiple heat sources. Background technique [0002] Since the 1970s, countries have begun to research and develop multi-chip component technology, which will be fully applied in the 21st century. At present, the main technology of packaging of electronic equipment is MCM (multi-chip module), and the density of electronic components packaged by MCM technology is also gradually increasing. At the same time, the power of electronic components and chips has been increasing in recent years, and the chips will generate heat during operation, and the heat flux density will continue to increase. If the heat generated by the chip cannot be dissipated in time, the junction temperature of the components will continue to rise, affecting the normal operation and reliability of the system...

AI Technical Summary

Problems solved by technology

In recent years, flat heat pipes have been used in heat dissipation industries such as LEDs. However, when dissipating heat from multiple heat sources with different powers, the evaporation ends between the heat sources are connected in series. Usually, one heat sink absorbs multiple heat sources. There may be thermal coupling between each heat source, and the power loss per unit volume is very large, and the operating temperature of each heating electronic component may be different, so it is difficult to achieve uniform temperature, and local and overall thermal failure and thermal degradation will occur. At the same time After the flat heat pipe absorbs the heat emitted by high-power electronic components, the working medium in the capillary structure on the lower plate evaporates to take away the heat. At this time, if the capillary structure is too thick, the reaction time for the working medium to evaporate is long, and the heat transfer efficiency is not good. High; if the capillary structure is too thin, the capillary structure is prone to drying or even burning, which will affect the working performance of the heat pipe

If the steam or the liquid returned by capillary action travels too far, the resistance will increase sharply, which may lead to signs of dryness at the evaporation end and reduce heat transfer efficiency

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