Preparation method of copper target
A copper target and copper billet technology, which is applied in the field of semiconductor sputtering, can solve the problems of difficulty in controlling the film formation rate, easy deformation, and the inability to increase the target area.
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[0028] As mentioned in the background technology, in view of the ever-increasing demand for the coating area of magnetron sputtering, the area of the target material used for magnetron sputtering also increases accordingly, and at the same time, the requirements for the control of the film formation rate of magnetron sputtering also increase. more stringent. Correspondingly, higher requirements are also put forward for the hardness of the target. However, the hardness of metal copper is small, and the hardness of the target obtained through the existing preparation process is not enough to meet the requirements of magnetron sputtering for large-area targets. For this reason, the present invention provides a kind of preparation method of copper target material, refer to figure 1 As shown, the preparation method of the copper target of the present invention comprises steps:
[0029] S1: provide copper blank;
[0030] S2: Densifying the copper blank by using a hot forging ...
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