Dual-swinging cutting device for sapphires

A cutting device, sapphire technology, applied in the direction of fine working devices, stone processing equipment, working accessories, etc., can solve the problems of low cutting accuracy, high production cost, slow line speed, etc., to achieve high cutting accuracy, reduced production cost, Fast line speed effect

Inactive Publication Date: 2014-10-29
HUNAN UTECH TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the line speed of cutting in this way is too slow and the cutting precision is low
Moreover, after the rocking shaft of the cutting wheel is used for two to three days due to serious wear and tear, the resin sleeve on the shaft needs to be re-grooved. High cost

Method used

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  • Dual-swinging cutting device for sapphires

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Embodiment Construction

[0007] The technical content of the present invention will now be further described with reference to the accompanying drawings.

[0008] like figure 1 As shown, the left and right sides of the two cutting wheels 1 are provided with a diamond wire pay-off mechanism and a diamond wire take-up mechanism, and the diamond wire pay-off mechanism consists of a diamond wire pay-off roll 2, a pay-off transition wheel A3, a pay-off tension wheel 4, The pay-off transition wheel B5 is composed, and the diamond wire take-up mechanism is composed of the take-up transition wheel A6, the take-up tension wheel 7, the take-up transition wheel B8, and the diamond wire take-up roll 9; the upper and lower parts of the two cutting wheels 1 are provided with A swinging mechanism, the swinging mechanism is composed of a sapphire adhesive plate 10, a swing body 11, a swing shaft 12, a swing link 13, a gear ring 14, and a transmission gear 15. The sapphire adhesive plate 10 is connected to one end of ...

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PUM

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Abstract

The invention discloses a dual-swinging cutting device for sapphires. A diamond paying-off mechanism and a diamond taking-up mechanism are arranged on the left side and the right side of two cutting wheels respectively. The diamond paying-off mechanism is composed of a diamond paying-off roll, a paying-off transition wheel A, a paying-off tension wheel and a paying-off transition wheel B. The diamond taking-up mechanism is composed of a taking-up transition wheel A, a taking-up tension wheel, a taking-up transition wheel B and a diamond taking-up roll. Swinging mechanisms are arranged above and below the two cutting wheels respectively and composed of sapphire adhering plates, swinging bodies, swinging shafts, swinging connection rods, gear rings and transmission gears. According to the dual-swinging cutting device, multi-wire dual-swinging cutting is adopted, the cutting wheels with diamond wires wound around do not swing, the sapphires are driven to swing by the swinging mechanisms so as to be cut, the wire speed is high, and the cutting accuracy is high. The two swinging mechanisms are arranged, and therefore two sets of the sapphires can be cut at the same time, and the processing efficiency is high.

Description

technical field [0001] The invention relates to the technical field of high hardness material cutting, in particular to a sapphire double swing cutting device. Background technique [0002] At present, the cutting process of sapphire generally adopts the three-roll swing cutting technology, that is, the sapphire is cut by swinging around the cutting wheel with the diamond wire, but the sapphire itself does not swing. However, the line speed of cutting in this way is too slow and the cutting accuracy is low. Moreover, after two to three days of use, the swing shaft of the cutting wheel needs to be re-grooved due to severe wear and tear on the resin sleeve on the shaft. High cost. SUMMARY OF THE INVENTION [0003] Aiming at the shortcomings of the above-mentioned similar technical problems, the purpose of the present invention is to provide a sapphire double swing cutting device. [0004] The technical scheme of the present invention is: a sapphire double swing cutting de...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/04B28D7/00
Inventor 杨小木尹培利
Owner HUNAN UTECH TECH
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