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A kind of preparation method of aralkyl epoxy resin material for sealing semiconductor equipment

An aralkyl epoxy resin and sealing technology, which is applied in semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve problems such as high viscosity and poor curing, and achieve increased spiral flow length and reduced The effect of thermal expansion coefficient and good heat and humidity resistance

Inactive Publication Date: 2016-04-20
ANHUI JIALAN NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, there are problems of high viscosity and poor curability of commonly used semiconductor equipment sealing materials. At the same time, the sealing performance will decrease under high temperature and high humidity conditions, which limits the normal use of semiconductor equipment. Therefore, it is necessary to develop a A semiconductor device sealing material with good curing performance, low viscosity and good heat and humidity resistance

Method used

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  • A kind of preparation method of aralkyl epoxy resin material for sealing semiconductor equipment

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A preparation method of an aralkyl epoxy resin material for semiconductor device sealing, which is carried out by the following steps:

[0020] Step 1, the mass parts are 60 parts of silica powder, 5 parts of phenolic resin, 2 parts of polyester resin, 2 parts of tetrabromobisphenol A epoxy resin, 0.5 part of carnauba wax, 5 parts of antimony trioxide , 0.5 parts of triphenylphosphine, 0.5 parts of zinc naphthenate and 3 parts of tetraglycidyl diaminodiphenylmethane were placed in a mixing mixer and mixed uniformly, wherein the mixing speed was 80 rpm for 20 minutes;

[0021] Step 2: Put the mixed material obtained in Step 1 into a kneader, knead at 90° C., with a rotation speed of 1000 rpm for 15 minutes, and discharge after kneading;

[0022] Step 3, pulverizing the material kneaded in step 2 to 1-3 mm to obtain a finished product.

[0023] The particle size of the silica powder in the above preparation method is 150 mesh.

Embodiment 2

[0025] A preparation method of an aralkyl epoxy resin material for semiconductor device sealing, which is carried out by the following steps:

[0026] Step 1, the mass parts are 63 parts of silica powder, 7 parts of phenolic resin, 3 parts of polyester resin, 4 parts of tetrabromobisphenol A epoxy resin, 0.6 part of carnauba wax, 7 parts of antimony trioxide , 0.6 parts of triphenylphosphine, 0.6 parts of zinc naphthenate and 5 parts of tetraglycidyl diaminodiphenylmethane were placed in a mixing mixer and mixed uniformly, wherein the mixing speed was 83 rpm, and the time was 25 minutes;

[0027] Step 2: Put the mixed material obtained in Step 1 into a kneader, and knead at 95°C with a rotation speed of 1100 rpm for 15 minutes, and discharge after kneading;

[0028] Step 3, pulverizing the material kneaded in step 2 to 1-3 mm to obtain a finished product.

[0029] The particle size of the silica powder in the above preparation method is 180 mesh.

Embodiment 3

[0031] A preparation method of an aralkyl epoxy resin material for semiconductor device sealing, which is carried out by the following steps:

[0032] Step 1, the mass parts are 65 parts of silica powder, 8 parts of phenolic resin, 4 parts of polyester resin, 5 parts of tetrabromobisphenol A epoxy resin, 0.7 part of carnauba wax, 8 parts of antimony trioxide , 0.7 parts of triphenylphosphine, 0.8 parts of zinc naphthenate and 6 parts of tetraglycidyl diaminodiphenylmethane were placed in a mixing mixer and mixed uniformly, wherein the mixing speed was 90 rpm for 30 minutes;

[0033] Step 2, put the mixed material obtained in Step 1 into a kneader, knead at 98°C, the rotation speed is 1260 rpm, and the time is 18 minutes, and the material is discharged after kneading;

[0034] Step 3, pulverizing the material kneaded in step 2 to 1-3 mm to obtain a finished product.

[0035] The particle size of the silica powder in the above preparation method is 180 mesh.

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Abstract

The invention discloses a preparation method of a semiconductor equipment sealing aralkyl epoxy resin material, and the method is as follows: putting 60 to 70 parts of by mass of silica powder, 5 to 10 parts of by mass of phenolic resin, 2 to 6 parts of by mass of polyester resin, 2 to 8 parts of by mass of tetrabromobisphenol A epoxy resin, 0.5 to 1 part of by mass of carnauba wax, 5 to 10 parts of by mass of antimonous oxide, 0.5 to 1 part of by mass of triphenylphosphine, , 0.5 to 1 part of by mass of zinc naphthenate and 3 to 8 parts of by mass of tetraglycidyl diamino-diphenyl methane into a mixer to mix uniformly; putting the mixed material in a kneader for kneading at 90-100 DEG C for 10-20 minutes, and discharging after the kneading is completed; finally crushing the kneaded material to obtain the finished product. The semiconductor equipment sealing aralkyl epoxy resin material prepared by the method has the advantages of low viscosity, good heat resistance and humidity resistance and good curing properties, and can be effectively used in semiconductor equipment sealing.

Description

technical field [0001] The invention discloses a preparation method of an aralkyl epoxy resin material used for sealing semiconductor equipment, and belongs to the technical field of chemical materials. Background technique [0002] A semiconductor is a material whose electrical conductivity is between that of a conductor and an insulator at room temperature. Semiconductors have a wide range of applications in radios, televisions, and temperature measurement. With the development of high-density mounting of electronic components on printed circuit boards, semiconductor devices have changed from pin-type packages to surface-mount packages. In addition, surface mount ICs, LSIs, etc. have become thin and small packages in order to increase the mounting density and reduce the mounting height. Therefore, the area occupied by the components in the package increases, and the thickness of the package becomes very thin. In addition, with the multi-functionalization and large-capaci...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L61/06C08L67/00C08L63/02C08K13/02C08K3/36C08K3/22C08K5/50C08K5/098C08K5/18H01L23/29
Inventor 傅进
Owner ANHUI JIALAN NEW MATERIAL CO LTD
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