Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

LED moulded package technology

A packaging technology, LED bracket technology, applied in the direction of epoxy resin glue, adhesive type, adhesive additives, etc., can solve the problem of low heat dissipation efficiency, and achieve the effects of preventing chip work, delaying the thermal aging process, and good dredging Effect

Inactive Publication Date: 2014-10-01
江苏华程光电科技有限公司
View PDF4 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is: in order to overcome the problem of low heat dissipation efficiency in the LED molding packaging process in the prior art, a LED molding packaging process is provided, by using epoxy LED sealant containing nanometer metal powder, LED The sealant has a good channeling effect on heat energy, which can effectively prevent the work of the chip from being affected by local overheating caused by the heat accumulation of the chip, and delay the thermal aging process of the product

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A LED molded packaging process, comprising the steps of:

[0029] (1) Take the LED sealant, stir at room temperature for 3-5 minutes, and set aside;

[0030] (2) Put the pressure-welded LED bracket into the mold, clamp the upper mold and the lower mold, and vacuumize;

[0031] (3) Put the LED sealant into the entrance of the glue injection channel, heat it and press it into the mold rubber channel with the ejector pin, the LED sealant enters each LED molding groove along the glue channel, and solidifies, that is, the LED molding packaging process is completed;

[0032] The sealant is composed of two components A and B, by weight,

[0033] Where A component includes

[0034] Bisphenol A type epoxy resin 75 parts

[0035] Acryloxysilane coupling agent 4 parts

[0036] Bisphenol A 15.8 parts

[0037] Silicone defoamer 0.2 parts

[0038] 5 parts of nano-copper powder with a particle size of 50nm

[0039] B component includes

[0040] 95 parts of methyl hexahydrophth...

Embodiment 2

[0044] A LED molded packaging process, comprising the steps of:

[0045] (1) Take the LED sealant, stir at room temperature for 3-5 minutes, and set aside;

[0046] (2) Put the pressure-welded LED bracket into the mold, clamp the upper mold and the lower mold, and vacuumize;

[0047] (3) Put the LED sealant into the entrance of the glue injection channel, heat it and press it into the mold rubber channel with the ejector pin, the LED sealant enters each LED molding groove along the glue channel, and solidifies, that is, the LED molding packaging process is completed;

[0048] The sealant is composed of two components A and B, by weight,

[0049] Where A component includes

[0050] Bisphenol H-type epoxy resin and alicyclic epoxy resin 85 parts

[0051] Epoxy silane coupling agent and vinyl silane coupling agent 0.5 parts

[0052] Tetrabromobisphenol A, alkyl phthalate 10 parts

[0053] Silicone defoamer 0.05 parts

[0054] 5 parts of nano-silver powder and nano-aluminum ...

Embodiment 3

[0060] A LED molded packaging process, comprising the steps of:

[0061] (1) Take the LED sealant, stir at room temperature for 3-5 minutes, and set aside;

[0062] (2) Put the pressure-welded LED bracket into the mold, clamp the upper mold and the lower mold, and vacuumize;

[0063] (3) Put the LED sealant into the entrance of the glue injection channel, heat it and press it into the mold rubber channel with the ejector pin, the LED sealant enters each LED molding groove along the glue channel, and solidifies, that is, the LED molding packaging process is completed;

[0064] The sealant is composed of two components A and B, by weight,

[0065] Where A component includes

[0066] 80 parts of polyurethane modified epoxy resin

[0067] Amino silane coupling agent 3 parts

[0068] Alkyl phthalate 10 parts

[0069] Silicone defoamer 0.2 parts

[0070] 6.8 parts of nano-nickel powder with a particle size of 100nm

[0071] B component includes

[0072] 97 parts of methyl he...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
Login to View More

Abstract

The invention relates to the technical field of LED packaging, in particular to an LED moulded package technology. The technology includes the following steps that an LED sealant is taken and stirred for 3-5 minutes at room temperature for use; an LED support undergoing pressure welding is placed in moulds, the upper mould and the lower mould are combined, and vacuum pumping is carried out; the LED sealant is placed into the inlet of a sealant injecting channel, heated and pressed into a mould sealant channel through a push rod, the LED sealant enters LED forming grooves along the sealant channel and solidified, and the LED moulded package technology is achieved. According to the LED moulded package technology, the epoxy LED sealant containing nano metal powder is used and has a good heat diffusion function so that the situation that heat of a chip calculates, the chip is partially overheated and accordingly work of the chip is influenced can be effectively prevented, and the product thermal aging process is slowed down.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to an LED molding packaging process with good heat dissipation performance. Background technique [0002] In recent years, epoxy resin has been widely used in the sealing of optoelectronic semiconductor components such as LEDs and digital / dot matrix display modules. Epoxy resins for this purpose usually use acid anhydrides as curing agents, and the curing reaction generally needs to be carried out above 100°C, which consumes a lot of energy; although the cured product has good light transmittance and physical and chemical properties. But certain epoxy materials have excellent optical transmission, mechanical and adhesive properties. For example cycloaliphatic epoxy resins find particular utility as sealants or coatings to contain and protect LEDs. However, conventional epoxy materials often suffer from disadvantages such as the heat generated by the light emitters in the LED...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/56H01L33/64C09J163/00C09J11/04C09J11/06
CPCH01L33/52B29C45/14H01L33/56H01L2933/005
Inventor 严加彬
Owner 江苏华程光电科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com