Film for electronic components

Abstract

The invention discloses a film for electronic components. The film comprises a PET (Polyethylene Terephthalate) thin film, wherein the lower surface of the PET thin film is coated with a heat conductive electric conductive adhesive layer and release paper is adhered to the other surface of the heat conductive electric conductive adhesive layer. The heat conductive electric conductive adhesive layer is prepared from the following components in parts by weight: 80-145 parts of graphite powder, 80-125 parts of organosilicone, 0.2-0.4 part of a crosslinking agent, 40-95 parts of a multifunctional acrylate monomer, 0.5-0.9 part of an initiator and 50-300 parts of a solvent. The solvent is prepared from the following components in percentage by weight: 10-20% of methylbenzene, 40-90% of ethyl acetate and 30-60% of butanone. The film disclosed by the invention considers existing film performance and further facilitates heat dispersion and transmission of electronic components so as to further avoid centralization of local heat of an adhesive tape, thus, the service life of the product is prolonged.

Description

technical field [0001] The invention relates to a film for electronic components and belongs to the field of film technology. Background technique [0002] Due to the rapid advancement of technological innovation, electronic products are becoming more portable, smaller in size, and more powerful in function, which leads to higher integration. This leads to shrinking volume and stronger functions, which directly leads to higher and higher heat dissipation requirements of electronic components. However, the fan-type heat dissipation used in the past was gradually eliminated by the market due to its large size and noise. Then there are other heat dissipation materials, such as copper foil and aluminum foil, but due to limited resources and high prices, the heat dissipation effect is not as good as expected. Slowly, people are looking for new and efficient heat dissipation materials. Secondly, due to the diversity of electronic products, existing products often need to be cust...

AI Technical Summary

Problems solved by technology

This leads to shrinking volume and stronger functions, which directly leads to higher and higher heat dissipation requirements of electronic components.

However, the fan type heat dissipation used in the past was gradually eliminated by the market due to its large size and noise.

In turn, other heat dissipation materials have been produced, such as copper foil and aluminum foil heat dissipation. However, due to limited resources and high prices, the heat dissipation effect is not as good as imagined. Slowly, they are all looking for new and efficient heat dissipation materials.

Secondly, due to the diversity of electronic products, existing products often need to be customized, which makes it difficult to apply to specific use occasions and limits the promotion of its application; Thermally conductive and antistatic pressure-sensitive adhesive tapes have become the direction of efforts of ordinary skilled in the art

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