A device and method for surface modification of micro-nanoparticles
A micro-nano particle and surface modification technology, applied in the fields of nanotechnology, nanotechnology, nanotechnology, etc. for materials and surface science, which can solve the problem that the advantages of high uniformity of atomic layer deposition cannot be fully exerted and precursors are not fully utilized. , powder particles are difficult to disperse and other problems, to achieve the effect of promoting sufficient and uniform adsorption, improving deposition uniformity and adequacy, and increasing the area
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Embodiment 1
[0082] For AlH with a particle size of 50μm 3 The particle surface is coated with a layer of 10nm thick Al 2 O 3 The film reduces its impact sensitivity and improves safety. Select trimethyl aluminum (TMA) and water (H 2 O) is the precursor, its Mainly against The response equation is:
[0083] (A)AlOH * +Al(CH 3 ) 3 →AlOAl(CH 3 ) 2 * +CH 4
[0084] (B)AlCH 3 * +H 2 O→AlOH * +CH 4
[0085] Using the above-mentioned micro-nano particle surface modification device and the corresponding pressure-holding deposition process method:
[0086] 0.1g AlH 3 The particles are put into the powder particle loading device and installed in the reaction chamber, and connected with the magnetic fluid sealing device. Then the reaction chamber is sealed.
[0087] Turn on the vacuum pump, open the solenoid valve and the throttle valve to connect the reaction chamber with the vacuum pump, and pump the pressure of the reaction chamber to less than or equal to 1pa. Heat the reaction chamber to stabilize ...
Embodiment 2
[0091] For SiO with a particle size of 200nm 2 The particle surface is coated with a layer of 5nm thick Al 2 O 3 Thin film to study SiO 2 The surface structure of the particles. Select trimethyl aluminum (TMA) and water (H 2 17 O) is the precursor.
[0092] Using the above-mentioned micro and nano particle surface modification device and the corresponding balanced dispersion deposition process method:
[0093] SiO 2 The particles are put into the powder particle loading device and installed in the reaction chamber, and connected with the magnetic fluid sealing device. Then the reaction chamber is sealed.
[0094] Turn on the vacuum pump, open the solenoid valve and the throttle valve to connect the reaction chamber with the vacuum pump, and pump the pressure of the reaction chamber to less than or equal to 1pa. Heat the reaction chamber to stabilize the internal temperature at 200°C, and heat the precursor cylinder, the precursor branch pipeline, and the precursor quick response va...
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