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Preparing method of organosilicon-modified polyurethane-imide material and applications of the material

A polyurethane and silicone technology, applied in polyurea/polyurethane adhesives, adhesive types, adhesives, etc., can solve the problems of polyimide polyurethane chemical stability and less mechanical properties, and achieve stability Adhesive, excellent adhesiveness, anti-exposure effect

Inactive Publication Date: 2014-09-10
DONGGUAN DONGYANG SOLAR SCI RES & DEV CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, there are a lot of studies on polyimide polyurethane. For example, Chinese patent CN103509167A discloses a kind of anti-droplet and high temperature polyimide polyurethane and its preparation method. It has flame retardancy, high temperature resistance and high mechanical strength. Advantages of strength; Japanese patents JP2004002922 and JP2004002923 disclose a polyurethane-imide resin, which is used for circuit connection adhesives, has the characteristics of insulation and low temperature fast curing, but the chemical stability of polyimide polyurethane, Characteristics such as mechanical properties are less involved in the prior art

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Under a nitrogen atmosphere, add 40.00 g of polyoxypropylene diol (average molecular weight 2000), 6.97 g of toluene-2,4-diisocyanate and 0.047 g of dibutyltin dilaurate to a 250 mL four-neck flask and heat it up to 60°C and stir for reaction 3 After adding 4,4'-(hexafluoroisopropylidene)bisphthalic anhydride 4.44g and 15mL N,N-dimethylformamide (DMF) mixed solution to the reaction solution, at 60℃ Stir and react for 4 hours to obtain a prepolymer, lower the temperature to 20°C; then add the prepolymer solution obtained above to a mixed solution of γ-aminopropyltriethoxysilane (KH-550) 4.43g and 20mL DMF while stirring After being uniformly dispersed, a silicone-modified polyurethane-imide material is obtained.

[0028] The obtained silicone-modified polyurethane-imide material is coated on a polytetrafluoroethylene film-forming plate, and after forming a film at room temperature, it is placed in an oven and dried at 50° C. to form an adhesive film. After testing, the ...

Embodiment 2

[0030] Under a nitrogen atmosphere, add 40.00 g of polyoxypropylene diol (average molecular weight 2000), 6.97 g of toluene-2,6-diisocyanate and 0.094 g of dibutyltin dilaurate to a 250 mL four-neck flask and raise the temperature to 80°C and stir for reaction 2 After adding 4,4'-(hexafluoroisopropylidene)diphthalic anhydride 4.44g and 15mL DMF mixed solution to the reaction solution, stirred and reacted at 80°C for 3 hours to obtain a prepolymer, cooled to 30°C; then add the prepolymer solution obtained above into the mixed solution of γ-aminopropyltriethoxysilane (KH-550) 4.43g and 20mL DMF under stirring, and obtain the silicone modified Polyurethane-imide material.

[0031] The obtained silicone-modified polyurethane-imide material is coated on a polytetrafluoroethylene film-forming plate, and after forming a film at room temperature, it is placed in an oven and dried at 50° C. to form an adhesive film. After testing, the initial decomposition temperature of the obtained ...

Embodiment 3

[0033] Under a nitrogen atmosphere, 40.00 g of polyoxypropylene diol (average molecular weight 2000), 6.97 g of isophorone diisocyanate and 0.20 g of dibutyltin dilaurate were added to a 250 mL four-neck flask, and the temperature was raised to 90° C. and stirred for 1 hour; Afterwards, a mixed solution of 4,4'-(hexafluoroisopropylidene)bisphthalic anhydride 4.44g and 15mL DMF was added to the reaction solution, and the reaction was stirred at 90°C for 2 hours to obtain a prepolymer, and the temperature was lowered to 20°C. ℃; then add the prepolymer solution obtained above into the mixed solution of γ-aminopropyltriethoxysilane (KH-550) 4.43g and 20mL DMF under stirring, and obtain silicone modified polyurethane- imide material.

[0034] The obtained silicone-modified polyurethane-imide material is coated on a polytetrafluoroethylene film-forming plate, and after forming a film at room temperature, it is placed in an oven and dried at 50° C. to form an adhesive film. After t...

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Abstract

The invention discloses a preparing method of an organosilicon-modified polyurethane-imide material and applications of the material. The method includes preparing a diisocyanate end-capping prepolymer in a solvent under the action of an organotin catalyst by adoption of polyether glycol, diisocyanate and bis(phthalic anhydride) as raw materials; cooling to room temperature; and adding the prepolymer solution into an aminosilane coupling agent solution to obtain the organosilicon-modified polyurethane-imide material. The polymer prepared by the method combines characteristics of polyurethane, polyimide, fluoropolymer and organosilicone, has excellent mechanical properties, heat resistance, weather resistance and water proofness, and can be used in the field of high-temperature resistant adhesives, and the like.

Description

technical field [0001] The invention relates to the technical field of organosilicon materials, in particular to a method for preparing organosilicon-modified polyurethane-imide materials. Background technique [0002] Polyurethane (PU) has excellent properties such as friction resistance, low temperature resistance, and high elasticity, and has been widely used at present. However, PU has poor mechanical properties, heat resistance, weather resistance and waterproof performance, which limits the application of PU materials to a certain extent. Polyimide (PI) is a kind of high polymer with excellent heat resistance and mechanical properties. The imide structure is introduced into the main chain of polyurethane, so that the molecular chain contains both soft and hard segment structures of polyurethane and rigid segments. The imide ring structure can significantly improve the heat resistance and mechanical properties of PU. In the prior art, there are a lot of studies on pol...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G18/83C08G18/66C08G18/48C08G18/12C09J175/08
CPCC08G18/12C08G18/3802C08G18/4825C08G18/4854C08G18/6666C09J175/08
Inventor 李义涛刘新烁黄明富李伟安媛媛张兵兵游孟梦
Owner DONGGUAN DONGYANG SOLAR SCI RES & DEV CO LTD
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