Making method for high thermal conductive, high heat resistant and high CTI FR-4 copper-clad plate
A technology of CTIFR-4 and manufacturing method, which is applied in the field of copper clad laminates, can solve the problems of affecting the service life of LED products, poor reliability of through-holes, poor moisture resistance, etc., and achieve rapid heat dissipation, high-efficiency thermal conductivity, and good heat resistance. Effect
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[0031] The present invention will be described in further detail below through specific examples.
[0032] The manufacturing method of high thermal conductivity, high heat resistance and high CTI FR-4 copper clad laminate provided by the present invention comprises the following steps: respectively preparing the glue solution for the veneer layer and the glue solution for the inner material layer—gluing—lamination, heat press.
[0033] S1: Prepare the glue solution for veneer layer
[0034] Glue for veneer layer comprises following composition (parts by weight):
[0035]
[0036]
[0037] According to the above ratio, the glue solution for the veneer layer is evenly stirred for 8 hours, and the gel time is 264S.
[0038] Among them, the epoxy equivalent is 320g / eq, and the bromine content is 14.5% modified epoxy resin (this resin is a copolymer of bisphenol A epoxy resin and brominated epoxy resin); the level of bromine content will directly affect the The value of CT...
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