Method for improving exposure shape of photoresist and method for patterning semiconductor substrate
A patterning and semiconductor technology, which is applied in the field of patterning semiconductor substrates and improving the exposure morphology of photoresist, can solve the problems affecting the quality of lithography process, the quality of substrate or film layer, etc., and achieve the improvement of exposure quality and lithography Workmanship quality, avoiding collapse defects, and improving the effect of workmanship quality
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0026] In order to make the content of the present invention clearer and easier to understand, the content of the present invention will be further described below in conjunction with the accompanying drawings. Of course, the present invention is not limited to this specific embodiment, and general replacements known to those skilled in the art are also covered within the protection scope of the present invention.
[0027] As mentioned above, the thickness of the photoresist on the thicker metal layer is thicker, and because of the higher reflectivity of the semiconductor substrate surface, it is easy to form an inverted trapezoidal photoresist topography after exposure. Photoresists are prone to collapse defects. For this reason, the present invention adopts the method of forming a composite thin film layer on the surface of the semiconductor substrate, because the composite thin film layer has a relatively low surface reflectivity, thereby avoiding the occurrence of the abov...
PUM
Property | Measurement | Unit |
---|---|---|
temperature | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com