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A compound deformed high-strength cutting steel wire and its manufacturing method

A technology for cutting steel wires and manufacturing methods, which is applied in the direction of manufacturing tools, other household appliances, and fine working devices, etc. It can solve the problems of cumbersome manufacturing methods and achieve the effect of simple waveform characteristics

Active Publication Date: 2016-08-17
江苏宝钢精密钢丝有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method is more cumbersome

Method used

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  • A compound deformed high-strength cutting steel wire and its manufacturing method
  • A compound deformed high-strength cutting steel wire and its manufacturing method
  • A compound deformed high-strength cutting steel wire and its manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] Choose a disc element with a pure steel diameter of 5.5mm with a carbon content of 0.80-0.96%, a silicon content of 0.12-0.40%, and a manganese content of 0.30-0.65%. After large drawing, intermediate heat treatment and middle drawing, it is made into a middle drawing wire with a diameter of 0.86mm.

[0051] The middle-drawn steel wire is heat-treated - alkali and acid-deoxidized to clean the surface - copper plating and galvanizing - thermal diffusion into brass - surface cleaning treatment - saponification treatment into semi-finished yellow wire. Yellow silk is controlled according to the following standards:

[0052]

Diameter (μm)

Strength (mPa)

Plating weight (g / kg)

Surface copper content %

Copper content %

scope

-25-+25

1230～1330

5.5～9

58～64

62～72

[0053] 1) On the wire drawing machine, it is drawn into a straight-faced wire of 0.115mm through 23 passes;

[0054] 2) The straight-faced steel wire is intro...

Embodiment 2

[0059] 1) Choose a disc element with a diameter of 5.5mm of pure steel with a carbon content of 0.80-0.96%, a silicon content of 0.12-0.40%, and a manganese content of 0.30-0.65%. After large drawing, intermediate heat treatment and middle drawing, it is made into a middle drawing wire with a diameter of 0.90mm.

[0060] 2) The middle-drawn steel wire is heat-treated - alkali, acid, and oxide skin are removed to clean the surface - copper plating and galvanizing - thermal diffusion into brass - surface cleaning treatment - saponification treatment into semi-finished yellow wire. Yellow silk is controlled according to the following standards:

[0061]

Diameter (μm)

Strength(mpa)

Plating weight (g / kg)

Surface copper content %

Copper content %

scope

-25-+25

1230～1330

5.5～9

58～64

62～72

[0062] 3) On the wire drawing machine, it is drawn into a straight-faced wire of 0.120mm through 23 passes;

[0063] 4) The straight-fac...

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Abstract

The invention discloses a composite deformation type high-strength sawing wire and a manufacturing method thereof. The sawing wire is of a structure that edge-folding deformation exists in a single plane and bending deformation exists in three-dimensional space. In the single plane, the sawing wire is bent into a wavy structure, and crest heights of a composite deformed wire are identical within the spatial range. The composite deformation type high-strength sawing wire and the manufacturing method thereof solve the problems existing in traditional multi-wire cutting. The sawing wire has a periodical deformation feature, multiple inner spatial structures are formed by the deformed wire in each period, and then more mortar can be brought in when the sawing wire is used; meanwhile, auxiliary blades formed by edge-folding and bending deformation can play a role in chip removal, and the sawing wire is especially good at cutting hard and brittle materials such as solar silicon wafers, quartz, silicon ingots, ceramics, sapphire, gallium arsenide and stone.

Description

technical field [0001] The invention relates to a composite deformed high-strength cutting steel wire and a manufacturing method thereof, which are used for cutting silicon wafers, silicon ingots, quartz, gallium arsenide, silicon carbide and other materials. Background technique [0002] Since the beginning of the 21st century, the electronics industry, communications, and clean energy have developed rapidly, especially the rapid development and application of solar cells in the field of clean energy, which has brought about a blowout development of cutting in the field of hard materials. Especially the cutting of monocrystalline and polycrystalline silicon ingots (sheets). The total demand for cutting wire has exceeded 100,000 tons. Its cutting method adopts multi-line cutting. Its cutting process and characteristics are as follows: [0003] The main cutting device is composed of pay-off wheel, wire-passing wheel, tension stabilization system, guide wheel groove, wire n...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/04B21F45/00
Inventor 王昌海黄柏华李庆锋刘臣
Owner 江苏宝钢精密钢丝有限公司
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