Application of acid copper leveling agent

Abstract

The invention discloses an application of an acid copper leveling agent. The molecular structural formula of the acid copper leveling agent is shown in the specification. In the formula, an anion X is Cl<-> or Br<->; R1 is O or S or N, and R2, R3 and R4 can be one of H, alkyl groups, alkenyl groups, aralkyl groups, heteroarylalkyl groups, substituted alkyl groups, substituted alkenyl groups, substituted aralkyl groups or substituted heteroarylalkyl groups. The acid copper leveling agent is used in adjustable surface morphology wafer electroplating. Novel acid copper leveling agent molecules having the advantages of good water solubility, colorlessness, non-toxicity and environmental protection are designed and developed, and are different from previous dye leveling agents, and the novel acid copper leveling molecules are compounded with a traditional leveling agent or other molecules having a leveling effect to form the acid copper leveling agent as a composite leveling agent in acid copper electroplating, so the effective control of the copper electroplating surface morphology is realized by blending the molecule concentration proportions of the composite leveling agent in a same chemical system in order to meet demands of different technologies.

Description

technical field [0001] The invention relates to the field of advanced functional electronic chemicals in semiconductor chip technology, in particular to the application of an acid copper leveler. Background technique [0002] Copper metal is considered to be an excellent chip interconnection material due to its superior characteristics of electrical conductivity, thermal conductivity, lower melting point and elongation. As the feature size of the chip line width becomes smaller and smaller, the interconnection delay has become a key factor restricting the speed improvement of the integrated circuit. The copper electroplating process is a key technology for preparing copper interconnects, and the copper electroplating process is inseparable from a high-quality electroplating solution. Because the quality and chemical system of the copper electroplating solution directly determine the surface morphology of the copper pillar or copper rewiring layer. In today's MEMS or semico...

AI Technical Summary

Problems solved by technology

In the prior art, the control of the surface morphology and smoothness of the copper electroplating layer is mainly achieved through the conditions of the electroplating process and the addition of different chemical systems (that is, different additive systems). If the morphology needs to be adjustable, it will Involving the replacement of the electroplating chemical system, the operation is time-consuming and laborious

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