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Thermosetting resin composition and prepreg and laminated board prepared therefrom

A technology of resin composition and prepreg, which is applied in the direction of synthetic resin layered products, layered products, metal layered products, etc., which can solve the problem of insufficient CAF resistance of plates, affecting product quality and reliability, and slag dropping from plate punching/drilling and other problems, to achieve the effect of low peel strength, meet the needs of mechanical processing, and balance heat resistance

Active Publication Date: 2014-07-02
SHENGYI TECH SUZHOU
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The resin composition can improve the water absorption rate and processability of the board to a certain extent; however, it has been found in practical applications that the copper clad laminate has the following problems: (1) The toughness of the board is poor, and punching / drilling of the board will occur in the subsequent PCB processing process Hole slag, poor quality of hole wall, and plate cracking; (2) The plate has insufficient CAF resistance and is prone to electrochemical aging, resulting in micro-short circuit of the product, which affects product quality and reliability

Method used

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  • Thermosetting resin composition and prepreg and laminated board prepared therefrom
  • Thermosetting resin composition and prepreg and laminated board prepared therefrom
  • Thermosetting resin composition and prepreg and laminated board prepared therefrom

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Embodiment and

[0032] Embodiment and comparative example:

[0033] Unless otherwise specified below, "parts" represent "parts by weight", and "%" represent "% by weight":

[0034] A thermosetting resin composition, by solid weight, comprises the following components, as shown in the table below:

[0035] Table 1 Composition Formulation

[0036]

[0037] In the above table, component A means epoxy resin, component B means novolak resin, component C means tetrabromobisphenol A, and component D means accelerator.

[0038] A: Epoxy resin;

[0039] A1: o-cresol novolak epoxy resin, the softening point is about 60°C;

[0040] A2: o-cresol novolak epoxy resin, the softening point is about 70°C;

[0041] A3: o-cresol novolac epoxy resin, the softening point is about 85°C;

[0042] A4: o-cresol novolac epoxy resin, the softening point is about 100°C;

[0043] A5: bisphenol A novolak epoxy resin, the softening point is about 70°C;

[0044] A6: Bisphenol A type brominated epoxy resin, the sof...

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Abstract

The invention discloses a thermosetting resin composition, comprises the following components in solid weight: (a) 50-95 parts of o-cresol phenolic epoxy resin; (b) 5-32 parts of linear phenolic resin; (c) 2-42 parts of tetrabromo bisphenol A; and (d) 0.01-0.5 part of accelerator, wherein the hydroxyl equivalent ratio of the tetrabromo bisphenol A to the linear phenolic resin is 0.4-1.2. The laminated board prepared from the thermosetting resin composition is good in toughness and free from punching / rotating hole quality problem and cracking in the subsequent PCB (printed circuit board) manufacture process, the circuit board machining requirement can be well satisfied, and the thermosetting resin composition has positive practical significance.

Description

technical field [0001] The invention relates to a thermosetting resin composition, a prepreg and a laminate made by using the composition, and belongs to the technical field of electronic materials. Background technique [0002] In July 2006, the official implementation of the two directives promulgated by the European Union (the directive on the prohibition of the use of certain hazardous substances in electrical and electronic products and the directive on waste electrical and electronic products) marked that the global electronics industry will enter the era of lead-free soldering. Due to the increase in soldering temperature, the requirements for thermal reliability of copper clad laminates will be greatly increased. At the same time, the demand for materials with high electrical insulation performance is increasing, and electronic products have higher and higher requirements on the water absorption rate and CAF resistance of substrate materials. In order to meet this de...

Claims

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Application Information

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IPC IPC(8): C08L63/04C08L61/06C08L63/02C08G59/62B32B15/092B32B27/04
Inventor 易强唐卿珂崔春梅
Owner SHENGYI TECH SUZHOU
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