Induction sealing of inorganic substrates

A matrix, inorganic technology, applied in the field of sealing design, can solve the problem of glass losing toughness and so on

Inactive Publication Date: 2014-06-04
FELLOWES INC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In conventional furnace fired sealing glass materials, the glass loses its toughness when heated above about 300°C

Method used

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  • Induction sealing of inorganic substrates
  • Induction sealing of inorganic substrates
  • Induction sealing of inorganic substrates

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Embodiment Construction

[0025] In most selective sealing methods, localized heating occurs due to the presence of suitable absorbers or couplants in the sealing material, or due to preferential absorption of intentional electromagnetic waves, or due to selective induction of eddy current sealing in the vicinity of the seal. This results in selective heating of the seal. The control of various aspects of this selective sealing, such as: the amount and location of absorption and heat generation; control of heat dissipation through materials and sealing design to minimize the occurrence of thermal gradients or thermal shock, especially the selective sealing method of induction sealing, They are also another aspect of the invention.

[0026] The present invention involves the control of the amount of induced eddy current, where this energy is deposited, and the rate at which this energy is deposited, so that a high quality seal is formed where ruptures due to thermal shock or thermal expansion mismatch t...

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Abstract

A method of sealing at least two inorganic substrates together using an induction energy source comprising applying to at least one of the substrates a paste composition including a glass frit, and an induction coupling additive, bringing at least a second substrate into contact with the paste composition, and subjecting the substrates and paste to induction heating, thereby forming a hermetic seal between the two inorganic substrates.

Description

technical field [0001] The present invention relates to paste-based hermetic sealing systems for glass sheets, sealing materials, methods of applying these sealing materials, sealing designs for selectively controllable light absorption to heat and seal the systems. These hermetic seals are used in various applications such as (a) encapsulation of solar cells based on silicon, organic systems and thin films, (b) encapsulation of other electronic devices such as organic LEDs (OLEDs), (c) vacuum insulating glass for windows (VIG) components, (d) touch screen devices and (c) components based on architectural glass and automotive glass. Background technique [0002] In many glass-to-glass sealing applications such as solar cell packaging [crystalline silicon and based on cadmium telluride (CdTe), copper indium gallium selenide (CIGS), polymeric, elastic, thin film], OLED packaging, displays, Touchscreen and vacuum insulated glass (VIG) window sealing, as well as architectural &...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C27/00C03C8/24C03C3/00
CPCC03C8/22C03C27/04C03C8/04C03C8/14C03C8/24C03C8/18C03C27/10C04B37/005C04B2235/667C04B2237/10C03C3/066C03C3/093C03C3/122C03C27/06
Inventor 斯里尼瓦桑·斯里达兰乔治·E·萨科斯克钱德拉谢卡尔·S·卡迪尔卡格雷戈里·R·皮锐茨巴赫约翰·J·马洛尼
Owner FELLOWES INC
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