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Cuprous oxide powder and method of producing same

一种氧化亚铜、制造方法的技术，应用在氧化铜/氢氧化铜等方向，能够解决无法获得氧化亚铜粉末等问题

Active Publication Date: 2014-06-04
DOWA ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, in the method proposed in Japanese Patent Laid-Open No. 4-116109, the particle size of the obtained cuprous oxide powder is as large as about 4 μm, and it is impossible to obtain a cuprous oxide powder with a particle size in the submicron range.
In addition, in the method proposed in Japanese Patent Laid-Open No. 2006-22394, metal copper particles are directly reduced and precipitated from copper oxide, and cuprous oxide powder with a particle size in the submicron range cannot be obtained.

Method used

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  • Cuprous oxide powder and method of producing same
  • Cuprous oxide powder and method of producing same
  • Cuprous oxide powder and method of producing same

Examples

Experimental program
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Effect test

Embodiment 1

[0041] First, add 76.4 g of 48.5% by mass aqueous sodium hydroxide solution and 323.6 g of pure water to a 1L reaction tank, adjust the rotating speed of the stirring rod in the reaction tank to 441 rpm, and adjust the temperature in the reaction tank to 27.6 ° C to prepare the alkali solution.

[0042] Next, to the copper sulfate aqueous solution obtained by dissolving 93.4 g of copper sulfate pentahydrate in 258.3 g of pure water, ferrous sulfate (II) heptahydrate (manufactured by Kishida Chemical Co., Ltd.) was added as a divalent iron ion. After adding 0.032 g and the obtained aqueous solution to the alkali solution in the said reaction tank, it aged, stirring for 10 minutes, and copper hydroxide was deposited.

[0043] Next, an aqueous glucose solution prepared by dissolving 100.9 g of glucose as a reducing agent in 170.1 g of pure water was added to the slurry in the reaction tank, the temperature was raised to 70.6°C at 1.2°C / min, and the temperature of 70.6°C was maint...

Embodiment 2～9

[0045] Except that the addition amount of ferrous sulfate (II) heptahydrate is respectively set to 0.100g (Example 2), 0.169g (Example 3), 0.240g (Example 4), 0.659g (Example 5), 1.357 (Example 6), 2.050g (Example 7), 2.751g (Example 8), and 3.446g (Example 9), the cuprous oxide powder was obtained by the method similar to Example 1.

Embodiment 10

[0047] First, add 48.5 mass % sodium hydroxide aqueous solution 2.23kg and pure water 8.33kg in the reaction tank of 24L, the rotating speed of the stirring bar in the reaction tank is adjusted to 220rpm, the temperature in the reaction tank is adjusted to 27.6 ℃, prepare alkali solution.

[0048] Next, 2.181 g of ferrous sulfate (II) heptahydrate (manufactured by Kishida Chemical Co., Ltd.) was added as divalent iron ions to an aqueous copper sulfate solution obtained by dissolving 2.74 kg of copper sulfate pentahydrate in 6.54 kg of pure water, and After adding the obtained aqueous solution to the alkali solution in the said reaction tank, it aged, stirring for 10 minutes, and copper hydroxide was deposited.

[0049] Next, an aqueous glucose solution prepared by dissolving 0.74 kg of glucose as a reducing agent in 3.72 kg of pure water was added to the slurry in the reaction tank, the temperature was raised to 70.6°C at 1.2°C / min, and the temperature of 70.6°C was maintained...

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Abstract

A cuprous oxide powder with a particle diameter smaller than those found in the prior art, and a method of producing the cuprous oxide powder by the chemical reduction method are provided. This method of producing cuprous oxide powder involves adding an alkaline solution to a copper ion-containing solution (or adding a copper ion-containing solution to an alkaline solution) to generate copper hydroxide, and thereafter adding a reducing agent such as a reducing sugar to reduce and precipitate the cuprous oxide particles, wherein, before generating the copper hydroxide, divalent iron ions are added to the copper ion-containing solution in the amount of 0.00001-0.04 mols (10-40000ppm) relative to the amount of copper ions in the copper ion-containing solution, and a cuprous oxide powder containing 30ppm or more iron is produced which has a 0.5mum or lower average primary particle diameter measured by a scanning electron microscope (SEM) and a 0.8mum or lower 50% particle diameter (D50 diameter) calculated by a laser diffraction-type particle size distribution measurement.

Description

technical field [0001] The present invention relates to a cuprous oxide powder and a method for producing the same, and in particular, relates to a cuprous oxide powder suitable for use as a raw material of copper powder for electronic materials and a method for producing the same. Background technique [0002] Cuprous oxide powder is used as copper powder for electronic materials, preservatives for ship bottom coatings (antifouling coatings), fungicides, pesticides, conductive coatings, copper plating solutions, colorants related to kilns, catalysts, rectifiers, solar cells, etc. Raw materials and materials are used in various fields. [0003] When cuprous oxide powder is used as a raw material for copper powder for electronic materials, cuprous oxide powder is used as internal electrodes for forming laminated ceramic electronic components such as laminated ceramic capacitors and laminated ceramic inductors, laminated ceramic capacitors and laminated ceramics Raw material ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C01G3/02B22F9/20C22C9/00
CPCC01P2002/50B22F9/20C01P2004/51C01P2004/03B22F9/24C01P2004/62C22C29/12C01G3/02C22C9/00
Inventor 金城优树末永真一浅野彰宏
Owner DOWA ELECTRONICS MATERIALS CO LTD
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