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A method for encapsulating an electroluminescent device

A technology of electroluminescent devices and packaging methods, which is applied to electrical components, semiconductor devices, circuits, etc., and can solve the problems of reduced sealing performance, easy cracking and brittle epoxy resin, etc.

Active Publication Date: 2016-06-22
JIANGSU TIWIN OPTO ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, foreign countries (Japan, the United States, Europe, etc.) mainly use epoxy resin, silicone and other packaging materials and heat, light, and radiation curing technologies, but there are also many shortcomings, such as silver craze due to internal stress. The epoxy resin is easy to crack and become brittle, and the sealing performance is reduced.

Method used

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  • A method for encapsulating an electroluminescent device
  • A method for encapsulating an electroluminescent device
  • A method for encapsulating an electroluminescent device

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Embodiment Construction

[0027] Its technical route is as follows:

[0028] Preparation of silicone-modified epoxy resin matrix material:

[0029] Dissolve 7 grams each of organosilicon and epoxy resin with a weight ratio of 1:1 in 10 milliliters of xylene and cyclohexanone solvents of equal volume, stir with electromagnetic force, the temperature is 50 ° C, and the stirring time is 4 Then the above solution was mixed and added to a 100 ml three-neck round bottom flask, stirred by electromagnetic force, and then 0.01 moles of dibutyltin dilaurate catalyst was gradually added dropwise with a separatory funnel as the temperature changed, and the final temperature was controlled at 136°C , reacted for 10 hours, after the reflux reaction was completed, a light yellow transparent solution was obtained, and then the solvent was removed by distillation under reduced pressure to obtain a silicone-modified epoxy resin matrix glue material, which was in the form of a viscous light yellow transparent colloid mat...

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Abstract

Disclosed is a packaging method for electroluminescence devices. The packaging method comprises the steps that firstly, a metal cover formed in a stamped mode is provided, a dispensing machine coats a binder to the edge of the metal cover, a moisture absorption layer is arranged in the metal cover, then the metal cover is located and corresponds to the position of a to-be-packaged electroluminescence light emitting diode on a glass substrate, the glass substrate with the electroluminescence light emitting diode covers the metal cover and is combined with the edge of the metal cover in a pressed mode through the binder, and the binder hardens naturally. The binder is composed of, by weight, 65.0-75.0% of organosilicone / epoxy resin matrixes, 0.3-4.6% of ferroferric oxide fiber materials, 2.0% of ethyl orthosilicate cross-linking agents, 18.0-29.5% of mixture of polyvinyl alcohol and polyethylene, and the balance addition agents and phthalic acid ester plasticizer, wherein the gross is one hundred percent, the ferroferric oxide fiber materials are fiber materials with the porous surface, the diameter of a ferroferric oxide fiber is about 100-150 nm, and the diameter of each hole in the surface is about 20-30 nm.

Description

technical field [0001] The present invention relates to a packaging method for electroluminescent elements. More specifically, the packaging method of the present invention adopts a packaging method that has good bonding performance and can improve defects such as brittleness and cracking caused by the stress of the bonding material. An encapsulation method in which an adhesive material is used for encapsulation. Background technique [0002] Organic electroluminescent device (OELD) is a new type of flat display device newly developed at present. It has low turn-on and driving voltage, and can be driven by DC voltage. It can be matched with large-scale integrated circuits, and it is easy to achieve full color and light High brightness (>105cd / m2), high quantum luminous efficiency (2.01m / w), etc., but the service life of OELD devices cannot meet the application requirements. One of the technical difficulties that needs to be solved is the packaging material and packaging t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/56H01L33/00H01L33/48
CPCC09J11/04C09J163/00H01L33/56
Inventor 严圣军
Owner JIANGSU TIWIN OPTO ELECTRONICS TECH
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