Spin-photoelectron device and spin injection method thereof
An electronic device and spin injection technology, which is applied to electrical components, semiconductor devices, circuits, etc., can solve the problems of low spin injection efficiency and spin loss, and achieve the effect of solving serious spin loss and improving efficiency
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Embodiment 1
[0038] A spin optoelectronic device described in this embodiment, such as figure 1 and figure 2 As shown, on the substrate layer 1, a p-type buffer layer 2, a barrier layer 3, a first barrier layer 4, a coupled quantum well and a quantum dot structure, a second barrier layer 7, an n-type contact layer 8, and electrodes are grown sequentially. layer, the n-type contact layer 8 forms a spin injection structure with the electrode layer. The electrode layer adopts magnetic metal material, and the magnetic metal material is preferably Fe, Co, Ni and alloys thereof. Wherein, the substrate layer 1 is preferably a p-type substrate.
[0039] The spin optoelectronic device described in this embodiment uses the spin injection structure formed by the n-type contact layer and the electrode layer to transmit the spin-polarized electrons generated in the electrode layer to the coupled quantum well and quantum dot structure, which solves the problem of existing The problem of extremely lo...
Embodiment 2
[0049] This embodiment provides a spin injection method based on the spin optoelectronic device described in Embodiment 1, such as image 3 shown, including the following steps:
[0050] S1: Apply a forward bias voltage between the p-type buffer layer or substrate layer and the upper electrode material layer, and use the spin injection structure to transfer the spin-polarized electrons generated in the electrode layer to the coupled quantum well and quantum dot structure ;
[0051] S2: Radiative recombination of the spin-polarized electrons in the coupled quantum well and quantum dot structure with holes injected from the p-type buffer layer to form circularly polarized light.
[0052] Wherein said step S1 specifically includes:
[0053] A forward bias voltage is applied between the p-type buffer layer or substrate layer and the upper electrode material layer through a metal lead, using a magnetic metal-semiconductor (M-S) Schottky junction or a magnetic metal-oxide-semicond...
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