Micro light-condensing photovoltaic welding ribbon and preparation process thereof

Abstract

The invention discloses a micro light-condensing photovoltaic welding ribbon and a preparation process thereof. The micro light-condensing photovoltaic welding strip comprises a base ribbon. The base ribbon is provided with a light receiving surface, a back surface and side surfaces. The light receiving surface is of a saw-toothed structure. A reflecting plating layer is arranged on the light receiving surface. The reflecting plating layer is made of a metal or alloy material with thickness of 500nm-5 [mu]m, a melting point above 232DEG C and reflectivity above 65 percent under the illumination of light waves with wavelength in a range of 300nm-1200nm. Plating layers are arranged on the back surface and the side surfaces and are made of metal or alloy materials with thickness of 10 -25 [mu]m and a melting point below 232DEG C. The micro light-condensing photovoltaic welding ribbon disclosed by the invention has the advantages that not only can the dependence of the welding ribbon on a conductive adhesive bonding technology be reduced and can the manufacturing cost be decreased, but also the micro light-condensing effect can be improved and the power of a module is improved.

Description

technical field [0001] The invention relates to a micro-concentrating photovoltaic welding ribbon and a preparation process thereof, belonging to the technical field of photovoltaic welding ribbons. Background technique [0002] At present, photovoltaic ribbons are the key auxiliary materials for connecting solar cells into strings. Solar cells are connected by ribbons to form a complete electrical path. Light energy is converted into electrical energy through solar cells, and the generated current forms a transmission circuit through ribbons. Use solar energy to provide access foundations. The surface of ordinary ribbon is relatively flat after welding, and the light entering the component is incident on the flat ribbon surface, which cannot be used through mirror reflection; currently there are some special shaped ribbons, and the upper surface of the ribbon is processed into a certain reflective groove Groove structure, the included angle of the reflective groove on the ...

AI Technical Summary

Problems solved by technology

The surface of ordinary ribbon is relatively flat after welding, and the light entering the component is incident on the flat ribbon surface, which cannot be used through mirror reflection; currently there are some special shaped ribbons, and the upper surface of the ribbon is processed into a certain reflective groove Groove structure, the included angle of the reflective groove on the surface is 110°~130°, and all the outer surfaces of the solder strip are coated with Ag. The secondary reflection reaches the surface of the cell and is reused, thereby improving the utilization rate of incident light. The current component manufacturing process of the ribbon needs to be combined with low-temperature bonding equipment. The low-temperature bonding equipment adopts conductive tape bonding method; conductive tape The molding temperature is lower than the melting point of the highly reflective metal coating on the surface of the ribbon, so as to ensure that the initial shape is maintained after soldering and achieve the best micro-light concentrating effect. The back soldering strip is bonded to the surface of the back electrode through conductive adhesive. This structure has good bonding stability, but the equipment cost of low-temperature soldering technology is more than 100% higher than that of ordinary automatic soldering machines, and it is necessary to consider adding low-resistance components such as Ag. The material cost of the conductive tape of conductive particles restricts the application of this technology

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