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Single wafer cleaning method

A wafer and single-chip technology, which is applied in the field of single-chip cleaning of wafers, can solve problems affecting the effect of single-chip cleaning of wafers, and achieve the effects of increasing cleaning effects, reducing fluorine residues, and easy removal

Active Publication Date: 2014-03-12
SEMICON MFG INT (SHANGHAI) CORP
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  • Abstract
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Problems solved by technology

And this affects the effect of wafer cleaning

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Embodiment Construction

[0026] In the following description, numerous specific details are given in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without one or more of these details. In other examples, some technical features known in the art are not described in order to avoid confusion with the present invention.

[0027] In order to provide a thorough understanding of the present invention, the detailed structure will be set forth in the following description. It is evident that the practice of the invention is not limited to specific details familiar to those skilled in the art. Preferred embodiments of the present invention are described in detail below, however, the present invention may have other embodiments besides these detailed descriptions.

[0028] Such as figure 1 As shown, the single-wafer cleaning method of the wafer according to the first embodiment of pe...

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Abstract

The invention discloses a single wafer cleaning method. The single wafer cleaning method comprises the steps that a wafer after dry etching is subjected to plasma processing through polar gas molecules, the polarity of the surface of the wafer is increased, so that the surface of the wafer is changed from hydrophobicity to hydrophily, and then the wafer is wet cleaned. By means of the single wafer cleaning method, the wafer can be well covered with liquid, a polymer on the surface of the wafer is changed into a short chain polymer and can be removed more easily, as a result, the cleaning effect in the wet cleaning process is greatly improved, and fluorine residues on the wafer after cleaning are reduced. According to the single wafer cleaning method, the polarity of the surface of the wafer can be changed with no need for adding a special chemical agent into the liquid in the wet cleaning process.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a wafer single-chip cleaning method. Background technique [0002] Wafer cleaning has always been a very important process in the semiconductor manufacturing process. During the complex manufacturing process of semiconductor wafers such as etching, stripping and dicing, pollutants such as very fine dust and etching and corrosion residues will be generated, which will settle or splash on the wafer and cover the solder joints. plate. As integrated circuits shrink, the concomitant reduction in pad size increases susceptibility to pad contamination, which can lead to poor pad tensile strength and cross-joint strength uniformity, which will It has a very serious impact on the quality of the entire wafer. Therefore, after the wafer is fabricated, it is a very important process step to clean the alignment and remove the contamination on the surface of the wafer and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B7/00H01L21/02
CPCY02P80/30H01L21/02057B08B3/10
Inventor 符雅丽张海洋
Owner SEMICON MFG INT (SHANGHAI) CORP
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