Method for manufacturing high-refractive-index silicon nitride antireflection film
A silicon nitride reduction and high refractive index technology, applied in the field of solar cells, can solve the problems of reduced open-circuit voltage and short-circuit current, and reduced conversion rate of finished products.
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Embodiment 1
[0014] (1) Deposit the crystalline silicon wafer after cleaning, texturing, diffusion and etching by tubular PECVD to obtain the first layer of high refractive index silicon nitride anti-reflection film. The PECVD parameters are set as: ammonia gas flow rate 6.5slm, silane flow rate 750sccm , pressure 1600mTorr, RF power 7300w, switch time 5:50ms, time 80s;
[0015] (2) Deposit the anti-reflection film obtained after step (1) by tubular PECVD again to obtain the second layer of high-refractive-index silicon nitride anti-reflection film. The PECVD parameters are set to: ammonia gas flow rate 4.8slm, silane flow rate 850sccm, pressure 1600mTorr, RF power 7300w, switch time 5:50ms, time 280s;
[0016] (3) Deposit the anti-reflection film obtained after step (2) by tubular PECVD again to obtain the third layer of low-refractive-index silicon nitride anti-reflection film. The PECVD parameters are set to: ammonia gas flow rate 6.5slm, silane flow rate 650sccm, pressure 1600mTorr, T...
Embodiment 2
[0019] (1) Deposit the crystalline silicon wafer after cleaning, texturing, diffusion and etching by tubular PECVD to obtain the first layer of high refractive index silicon nitride anti-reflection coating. The PECVD parameters are set to: ammonia gas flow rate 7 slm, silane flow rate 800 sccm , pressure 1700mTorr, RF power 7000w, switching time 5:50ms, time 100s;
[0020] (2) Deposit the anti-reflection film obtained after step (1) by tubular PECVD again to obtain the second layer of high-refractive-index silicon nitride anti-reflection film. The PECVD parameters are set to: ammonia gas flow rate 5.2slm, silane flow rate 900sccm, pressure 1700mTorr, RF power 7000w, switch time 5:50ms, time 300s;
[0021] (3) Deposit the anti-reflection film obtained after the completion of step (2) by tubular PECVD again to obtain the third layer of low-refractive index silicon nitride anti-reflection film. The PECVD parameters are set as: ammonia gas flow rate 6.8 slm, silane flow rate 680 s...
Embodiment 3
[0024] (1) Deposit the crystalline silicon wafer after cleaning, texturing, diffusion and etching by tubular PECVD to obtain the first layer of high refractive index silicon nitride anti-reflection film. The PECVD parameters are set as: ammonia gas flow rate 7.2slm, silane flow rate 850sccm , pressure 1800mTorr, RF power 6500w, switching time 5:50ms, time 130s;
[0025] (2) Deposit the anti-reflection film obtained after step (1) by tubular PECVD again to obtain the second layer of high refractive index silicon nitride anti-reflection film. The PECVD parameters are set to: ammonia gas flow rate 5.5slm, silane flow rate 950sccm, pressure 1800mTorr, RF power 6500w, switch time 5:50ms, time 330s;
[0026] (3) Deposit the anti-reflection film obtained after the completion of step (2) by tubular PECVD again to obtain the third layer of low-refractive index silicon nitride anti-reflection film. The PECVD parameters are set to: ammonia gas flow rate 7.5slm, silane flow rate 750sccm, ...
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