Double-85 anti-PID polycrystalline solar cell manufacturing process
A technology for solar cells and manufacturing processes, applied in sustainable manufacturing/processing, circuits, photovoltaic power generation, etc., can solve problems such as the power drop of cells and modules, and achieve the effect of extending the life of modules, good product performance, and convenient inspection.
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Embodiment 1
[0072] The manufacturing process of the double 85 anti-PID polycrystalline solar cells comprises the following steps:
[0073] a. The crystalline silicon wafer after cleaning, diffusion, and etching will generate a layer of 1nm SiO on the surface of the crystalline silicon wafer through an ozone generator 2 Oxide film;
[0074] b. Put the crystalline silicon wafer completed in step a on the graphite boat through the loading and unloading system, and put it into the tubular PECVD for pre-deposition. The PECVD parameters are set as: ammonia gas flow rate 4.5-5.0slm, radio frequency power 5000-6000wart , time 0-60s;
[0075] c. Deposit the crystalline silicon wafer completed in step b by tubular PECVD to obtain a high-refractive-index silicon nitride anti-reflection film with a first-layer refractive index of 2.30-2.35. The PECVD parameters are set to: ammonia gas flow rate 4.5- 5.0slm, silane flow rate 1000-1100sccm, pressure 1650-1750mTor, RF power 5500-6500wart, switching ti...
Embodiment 2
[0087] The manufacturing process of the double 85 anti-PID polycrystalline solar cells comprises the following steps:
[0088] a. After cleaning the textured, diffused and etched crystalline silicon wafer, generate a layer of 2nm SiO on the surface of the crystalline silicon wafer through an ozone generator 2 Oxide film;
[0089] b. Put the crystalline silicon wafer completed in step a on the graphite boat through the loading and unloading system, and put it into the tubular PECVD for pre-deposition. The PECVD parameters are set as: ammonia gas flow rate 4.5-5.0slm, radio frequency power 5000-6000wart , time 0-60s;
[0090] c. Deposit the crystalline silicon wafer completed in step b by tubular PECVD to obtain a high-refractive-index silicon nitride anti-reflection film with a first-layer refractive index of 2.30-2.35. The PECVD parameters are set to: ammonia gas flow rate 4.5- 5.0slm, silane flow rate 1000-1100sccm, pressure 1650-1750mTor, RF power 5500-6500wart, switching ...
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