Numerically controlled diamond wire saw slicing machine

Abstract

The invention provides a numerically controlled diamond wire saw slicing machine. The numerically controlled diamond wire saw slicing machine comprises a machine frame, a workpiece clamping feeding device and a reeling winding device and an unreeling winding device which are arranged on bilateral sides of lathe bed and guide rollers are arranged on bilateral sides of the machine frame. The numerically controlled diamond wire saw slicing machine is characterized in that diamond wires repeatedly are wound on the two guide rollers in an interval mode sequentially; a cooling lubricant nozzle which is corresponding to the diamond wires is arranged on the machine frame. The numerically controlled diamond wire saw slicing machine has the advantages of simplifying sawing technologies, improving the sawing efficiency, meanwhile avoiding sand pulp splash generating pollution to environment and effectively protecting the environment.

Description

technical field [0001] The invention relates to the technical field of CNC machine tool automation, in particular to a CNC diamond wire saw slicer. Background technique [0002] After the short-term downturn in the photovoltaic industry, with the national macro-control of the industry and the relaxation of foreign policies on my country, the demand for mono- and polycrystalline silicon in solar power generation has increased, and the utilization of mono- and polycrystalline silicon is mainly mono- and polycrystalline silicon wafers. Ordinary multi-wire slicing machines cannot meet the needs. In order to improve the efficiency of wire saw slicing, with the development of technology, existing slicing machines usually use steel wires to rotate through rollers, and spray mortar on the rotating steel wires to achieve silicon wafers. For cutting, using the existing slicer, it is necessary to attach a mortar stirring device to provide mortar, and the temperature of the mortar will ri...

AI Technical Summary

Problems solved by technology

[0002] After the short-term downturn in the photovoltaic industry, with the national macro-control of the industry and the relaxation of foreign policies on my country, the demand for mono- and polycrystalline silicon in solar power generation has increased, and the utilization of mono- and polycrystalline silicon is mainly mono- and polycrystalline silicon wafers. Ordinary multi-wire slicing machines cannot meet the needs. In order to improve the efficiency of wire saw slicing, with the development of technology, existing slicing machines usually use steel wires to rotate through rollers, and spray mortar on the rotating steel wires to achieve silicon wafers. For cutting, using the existing slicer, it is necessary to attach a mortar stirring device to provide mortar, and the temperature of the mortar will rise after passing through the high-speed steel wire, which reduces the sawing efficiency. Usually, the mortar has to be cooled, and the process is more complicated. Complicated, the sawing efficiency of the wire saw slicer is low, and the mortar is sprayed on the high-speed steel wire, which will cause the mortar to splash and pollute the environment

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