Image sensor packaging structure and packaging method based on glass substrate

Abstract

The invention provides an image sensor packaging structure based on a glass substrate, which includes a transparent glass substrate, the front and back of the glass substrate are provided with wiring structures and are electrically connected to each other; In the transparent area of ​​the structure, the inverted image sensor chip is mounted on the back of the glass substrate by flip-chip welding, and the sensing surface of the image sensor chip faces the transparent area of ​​the glass substrate; the image sensor chip and the back of the glass substrate The wiring structure outside the transparent area is electrically connected; the heat sink is fixed on the back of the image sensor chip; the passive device and the image sensor driver chip are mounted on the front of the glass substrate outside the transparent area and electrically connected to the wiring structure on the front; BGA solder balls are planted in the region where the wiring structure on the back of the glass substrate is located. The image sensing chip of the present invention has better parallelism between the sensing surface and the plane of the glass substrate, and has better heat dissipation effect.

Description

technical field [0001] The invention relates to a packaging technology, in particular to a glass substrate-based image sensor packaging structure and packaging method. Background technique [0002] At present, the traditional CIS (image sensor) packaging is usually packaged by wire bonding. There are some problems, such as the poor heat dissipation performance of the formed CIS packaging structure, which affects the imaging performance of the CIS chip. In addition, the traditional CIS packaging process The process faced in the process is relatively cumbersome. Moreover, due to the thickness control of the adhesive behind the CIS chip and the deviation when mounting the glass sheet used to protect the CIS chip during wire bonding packaging, the sensing surface of the chip in the CIS package is parallel to the glass surface. There is a problem. Contents of the invention [0003] The purpose of the present invention is to overcome the deficiencies in the prior art, provide ...

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Problems solved by technology

[0002] At present, the traditional CIS (image sensor) packaging is usually packaged by wire bonding. There are some problems, such as the poor heat dissipation performance of the formed CIS packaging structure, which affects the imaging performance of the CIS chip. In addition, the traditional CIS packaging process The process faced in the process is relatively cumbersome

Moreover, due to the thickness control of the adhesive behind the CIS chip and the deviation when mounting the glass sheet used to protect the CIS chip during wire bonding packaging, the sensing surface of the chip in the CIS package is parallel to the glass surface. There is a problem

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