Imaging sensor packaging structure and method based on glass substrate

Abstract

The invention provides an imaging sensor packaging structure based on a glass substrate. The imaging sensor packaging structure comprises a transparent glass substrate, wiring structures are arranged on the front face and the back face of the glass substrate respectively and electrically connected mutually, at least one transparent area is arranged on the glass substrate and does not contain the wiring structures, inverted image sensing chips are attached to the back face of the glass substrate in a flip-chip bonding mode, and the sensing faces of the image sensing chips face toward the transparent area of the glass substrate; the image sensing chips are electrically connected with the wiring structures outside the transparent area on the back face of the glass substrate; heat sinks are fixed to the back faces of the image sensing chips; passive devices and image sensor driving chips are attached to the portion outside the transparent area on the front face of the glass substrate and electrically connected with the wiring structures of the front face; BGA welded balls are embedded into the area, where the wiring structures are located, of the back face of the glass substrate. The parallelism degree between the sensing faces of the image sensing chips and the glass substrate plane and the heat dissipation effect are better.

Description

technical field [0001] The invention relates to a packaging technology, in particular to a glass substrate-based image sensor packaging structure and packaging method. Background technique [0002] At present, the traditional CIS (image sensor) packaging is usually packaged by wire bonding. There are some problems, such as the poor heat dissipation performance of the formed CIS packaging structure, which affects the imaging performance of the CIS chip. In addition, the traditional CIS packaging process The process faced in the process is relatively cumbersome. Moreover, due to the thickness control of the adhesive behind the CIS chip and the deviation when mounting the glass sheet used to protect the CIS chip during wire bonding packaging, the sensing surface of the chip in the CIS package is parallel to the glass surface. There is a problem. Contents of the invention [0003] The purpose of the present invention is to overcome the deficiencies in the prior art, provide ...

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Problems solved by technology

[0002] At present, the traditional CIS (image sensor) packaging is usually packaged by wire bonding. There are some problems, such as the poor heat dissipation performance of the formed CIS packaging structure, which affects the imaging performance of the CIS chip. In addition, the traditional CIS packaging process The process faced in the process is relatively cumbersome

Moreover, due to the thickness control of the adhesive behind the CIS chip and the deviation when mounting the glass sheet used to protect the CIS chip during wire bonding packaging, the sensing surface of the chip in the CIS package is parallel to the glass surface. There is a problem

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