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Installer for processor

A processor and installer technology, applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of poor cooling effect and difficult to meet the requirements

Active Publication Date: 2014-01-29
泰州市智谷软件园有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it only cools specific components, and the cooling effect on the surrounding environment is poor; and in the case of a large amount of heat accumulation, the effect of this cooling method is also difficult to meet the requirements

Method used

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  • Installer for processor
  • Installer for processor
  • Installer for processor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] An installer for a processor, comprising an accommodating module and an installation module, the installation module includes a connector and a mounting piece, and the connector is used to electrically connect the mounting piece to a component in a control cabinet that needs to be installed with a processor , which includes a connector external insert 25 and a connector internal insert 24, the connector external insert 25 is used to electrically connect with the processor socket in the control cabinet; the mounting includes a mounting insert 26, a cylindrical fixing portion 23 , the mounting base 22 and the cylindrical support portion 21, the mounting insert 26 is cylindrical, it can fix the mounting, and can be electrically connected with the internal insert 24 of the connector, the mounting base 22 is used for installing The processor, so that the processor is electrically connected to the components in the control cabinet that need to be installed with the processor. ...

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Abstract

The invention provides an installer for a processor. The installer for the processor comprises a containing module and an installing module. The installing module comprises a connector and an installing piece, the containing module comprises a body part and an air pumping part, and the body part comprises an upper semicircle part and a lower semicircle part. A circular vent hole is further formed in a cylindrical cooling liquid barrier layer. Bearing semicircle rings are arranged at the left end of the upper semicircle part and at the left end of the lower semicircle part respectively. An upper semicircle block and a lower semicircle block are arranged at the right end of the upper semicircle part and at the right end of the lower semicircle part respectively, after the upper semicircle part and the lower semicircle part are fastened to form a cylinder, the upper semicircle block and the lower semicircle block are fastened to form a circular block with a circular blind hole in the middle, and one end, far away from the cylinder, of the circular block is closed.

Description

technical field [0001] The present application relates to a mounting device, in particular to a mounter for a processor. Background technique [0002] Processor (eg CPU, PLC) components are frequently used in control cabinets. Heat buildup typically occurs in a control cabinet due to the presence of one or more processors and other electrical components. The processor itself is affected not only by the heat dissipated by itself, but also by the ambient heat in the control cabinet. [0003] If the heat is not dissipated in time, it will cause a crash in the slightest, and may burn the CPU in the severest case. The radiator plays a decisive role in the stable operation of the CPU. CPU radiators can be divided into three types according to their heat dissipation methods: air cooling, heat pipe cooling and water cooling. Air-cooled radiators are the most common type of radiators today. The principle is to transfer the heat generated by the CPU to the heat sink, and then take...

Claims

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Application Information

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IPC IPC(8): H05K7/20H01L23/473
Inventor 黄肖峰
Owner 泰州市智谷软件园有限公司
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