Electroplating base material degreasing agent and preparation method thereof
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A degreaser and base material technology, applied in the field of surface pretreatment of plated workpieces, can solve problems such as polluting the environment and harming human health, and achieve the effects of low substance concentration, energy saving, and excellent degreasing performance.
Active Publication Date: 2014-01-29
ADVANCED TECHNOLOGY & MATERIALS CO LTD
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Description
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Problems solved by technology
At this time, the volatilized alkaline substances will seriously damage human health and pollute the environment.
Method used
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Embodiment 1
[0032] A degreasing agent for electroplating substrates, comprising the following ratios: phosphoric acid 100.0g per liter, sodium gluconate 5.0g, sodium tripolyphosphate 4.0g, water softener trisodium phosphate 2.0g, emulsifier NP-10 0.2ml , and the balance is water.
[0033] The preparation method is as follows: according to the above ratio, dissolve phosphoric acid, sodium gluconate, sodium tripolyphosphate, water softener trisodium phosphate and emulsifier NP-10 in water and fully stir to dissolve.
Embodiment 2
[0035] An electroplating base material degreasing agent, comprising the following material ratio: 300.0g phosphoric acid per liter, 2.0g sodium gluconate, 2.0g sodium tripolyphosphate, 4.0g pentasodium phosphate water softener, 0.3ml emulsifier OP-10 , and the balance is water.
[0036] The preparation method is as follows: according to the above ratio, dissolve phosphoric acid, sodium gluconate, sodium tripolyphosphate, water softener pentasodium phosphate and emulsifier OP-10 in water and fully stir to dissolve.
Embodiment 3
[0038] An electroplating base material degreasing agent, comprising the following material ratio: 200.0g phosphoric acid per liter, 3.0g sodium gluconate, 5.0g sodium tripolyphosphate, 1.0g pentasodium phosphate water softener, 0.4ml emulsifier NP-10 , 2.0 g of sodium dodecylbenzenesulfonate, and the balance is water.
[0039] The preparation method is as follows: according to the above ratio, dissolve phosphoric acid, sodium gluconate, sodium tripolyphosphate, water softener pentasodium phosphate, emulsifier NP-10 and sodium dodecylbenzenesulfonate in water and fully stir to dissolve.
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Abstract
The invention discloses an electroplating base material degreasing agent and a preparation method thereof and relates to a degreasing agent, and in particular relates to the technical field of surface pretreatment of plated workpieces. The degreasing agent contains the following substances per liter: 100.0-300.0 grams of phosphoric acid, 2.0-5.0 grams of sodium gluconate, 2.0-5.0 grams of sodium tripolyphosphate, 1.0-4.0 grams of water softener, 0.2-0.5ml of emulsifying agent and the balance of water. The preparation method comprises the steps of dissolving the phosphoric acid, the sodium gluconate, the sodium tripolyphosphate, the water softener and the emulsifying agent in the water at the ratio, fully stirring and dissolving. The degreasing agent disclosed by the invention does not adopt an alkaline solution and has the characteristics of low temperature, low concentration, acidity, little chemical component types, rapidness, cleanliness and high efficiency in degreasing, capability of saving lots of energy and low cost; the degreasing agent is particularly suitable for degreasing neodymium-iron-boron permanent magnet materials.
Description
technical field [0001] The invention relates to a degreasing agent, in particular to the technical field of surface pretreatment of a plated workpiece. Background technique [0002] The base material is the main body of metal surface treatment, and the quality of the base material is closely related to the performance of the final product. In order to prevent the substrate from being oxidized by oxygen in the air, the surface of the substrate is generally protected by a layer of grease. If these greases are not removed, it will not only pollute the plating solution during electroplating, causing the plating solution to lose balance and stability, but also make the bonding between the plating layer and the substrate weak, causing defects in the plating layer, such as pinholes, burrs, blisters, Defects such as peeling. Therefore, the grease on the surface of the substrate must be cleaned before electroplating. [0003] At present, common degreasing methods include organic s...
Claims
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Application Information
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