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A kind of sealing process of led module

An LED module and process technology, applied in the parts of lighting devices, semiconductor devices of light-emitting elements, lighting devices, etc., can solve the problems of high sealing cost and poor effect, achieve low cost, reduce glue usage, The effect of good sealing effect

Active Publication Date: 2015-12-02
HANGZHOU HPWINNER OPTO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a sealing process for LED modules to solve the technical problems of high sealing cost and poor effect

Method used

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  • A kind of sealing process of led module
  • A kind of sealing process of led module
  • A kind of sealing process of led module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] see Figure 1 to Figure 3, the technical solution adopted by a kind of LED sealing process is: a kind of LED illuminating device, comprises cooling rack 11, PCB board 12, LED chip, sealing silica gel and lens group 13, LED chip is welded on the PCB board 12, PCB board 12 and The cooling frame 11 is pasted together, and the lens group 13 is installed above the LED chip.

[0049] The cooling frame may include one lamp frame unit or multiple lamp frame units, and each lamp frame unit corresponds to a PCB board 12 , a lens group 13 and sealing silicone. The following takes a single light stand unit as an example:

[0050] The heat dissipation frame 11 can be cut from profiles, which not only plays the role of a light frame, but also acts as a heat sink. The processing process is simple and the cost is low. According to different needs, different shapes of profiles can be selected for the cooling frame.

[0051] The cooling frame 11 is provided with a through hole 21 with...

Embodiment 2

[0074] The process steps of embodiment 2 are roughly the same as those of embodiment 1, except that the solid silicone ring is placed in the groove of the outer ring of the lens group, and then a circle of liquid silicone is uniformly punched along the groove of the inner ring of the lens group. Other process steps are the same as in Example 1, and will not be repeated here.

Embodiment 3

[0076] Only one groove is arranged on the outer periphery of the lens group, one of the sealing ring and the liquid silicone is arranged in the groove, and the other is arranged on the inner or outer periphery of the groove.

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Abstract

A sealing process for an LED module, comprising: (1) the waterproof line passes through the wire hole of the cooling frame and is connected to the positive and negative solder joints on the PCB board, and the positive and negative solder joints and the position where the waterproof line passes are sealed with glue , and seal the waterproof operation between the waterproof line and the wire hole; (2) fix the PCB board on the heat sink; (3) place the solid silicone ring on the outer periphery of the lens group; (4) along the lens group Put liquid silica gel on the outer periphery, and the amount of liquid silica gel is limited to completely sticking to the solid silica gel ring; (5) The cooling frame equipped with PCB board and waterproof line is turned upside down on the solid silica gel ring and liquid silica gel treated in step (4). On the lens group, fix the radiator as a whole and the lens group. At least two waterproof sealing rings completely isolate the LED chip from the outside world, preventing all water vapor or other harmful gases from corroding the chip and PCB board. Compared with the film seal, it is stronger and has a longer life, and realizes the sealing performance between the lens group and the cooling frame. Assure.

Description

technical field [0001] The invention relates to an LED lighting device, in particular to a sealing process for the LED module. Background technique [0002] Under the current general trend of advocating energy conservation and environmental protection, LEDs are more and more widely used due to their characteristics of energy conservation and environmental protection, long service life, short start-up time, good safety and stability. At present, lighting devices of other light sources are gradually being used by LED lighting fixtures instead. [0003] During the use of LEDs, water vapor or other harmful gases often penetrate into the substrate, or the metal oxidizes, resulting in product failure. When the product is used for outdoor lighting, its airtightness and waterproofness are even more issues that need to be considered. [0004] The traditional waterproof structure of LED products is packaged in a box and fastened with screws. The product is thick and heavy, which has...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21V31/04F21Y101/02F21Y115/10
Inventor 陈凯黄建明
Owner HANGZHOU HPWINNER OPTO CORP
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