Atomic layer deposition method and atomic layer deposition device for coating ultrafine powder
A technology of atomic layer deposition and ultra-fine powder, which is applied in the direction of coating, gaseous chemical plating, metal material coating process, etc. Agglomeration and other problems can be improved to improve the powder coating rate and deposition uniformity, prolong the contact time and reduce the degree of agglomeration
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[0025] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not constitute a conflict with each other.
[0026] figure 1 It is a flowchart of an atomic layer deposition method for coating ultrafine powder in an embodiment of the present invention, including the following steps:
[0027] S11: Vacuumize the reaction chamber to ensure effective isolation of the reaction area from air.
[0028] S12: Continuously feed the fluidizing gas into the reaction chamber, the fluidizing gas flow rate is 5-50cm...
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