A method for preparing vertical cavities on ltcc substrates

Abstract

The invention discloses a method for preparing a vertical cavity on an LTCC substrate, which can improve the quality of the vertical cavity and improve the performance of the vertical cavity. This method first selects the diaphragm A, film B, and diaphragm C; then cuts the film B into a film D; cuts and removes the part that is consistent with the length and width of the film D on the diaphragm C; then selects a certain number of diaphragms A is stacked one by one, and the film C and film D are put in during the stacking process; the laminated multi-layer film is pressed into a dense block; the block is cut with a cutting knife, and the block is cut after the cutting is completed. Excess dicing and film D are removed to form the desired vertical cavities. This method is to press the laminated multi-layer diaphragm into a dense block and then cut to form a vertical cavity. This method can greatly improve the quality of the vertical cavity and avoid the introduction of The problem of impurities and pollution is improved, the performance of the vertical cavity is improved, and it is suitable for popularization and application in the technical field of LTCC ceramic substrates.

Description

technical field [0001] The invention relates to the technical field of LTCC ceramic substrates, in particular to a method for preparing a vertical cavity on an LTCC substrate. Background technique [0002] With the development of microwave circuits towards high-density integration, it is also required that the microwave devices and chips used can be integrated in multilayer circuit substrates, and the preparation of vertical cavities is an important step for embedding microwave devices and chips in multilayer circuit substrates. means. Low-temperature co-fired ceramic (LTCC) technology is a mainstream multi-layer substrate technology. The quality of the vertical cavity prepared in LTCC, such as verticality, flatness, deformation and other characteristics, will affect the transmission loss and stability of the circuit. Accuracy and reliability, etc. have a direct impact, which is directly related to the performance of the entire circuit. [0003] At present, the method of p...

AI Technical Summary

Problems solved by technology

Among them, the filling inlay is to place rubber, film and other spacers in the vertical cavity before hot water isostatic pressing, and then insert a homogeneous porcelain block or metal block with the same size as the cavity. The vertical cavity prepared in this way The cavity has a high flatness of the bottom surface, but because spacers such as rubber and inlays will form a certain gap on the four sides of the vertical cavity, and this gap will cause a certain degree of curvature on the four edges of the vertical cavity and slight depressions, affecting the verticality of the cavity

Another way is to fill the vertical cavity with paraffin, and after isostatic pressing, the paraffin is vaporized during debinding and sintering. The vertical cavity prepared in this way has the advantages of high verticality and small deformation, but its The requirements for the firing atmosphere are high, and at the same time, the carbonization of paraffin or oxide residues are easily formed during the firing process, which will affect the microwave performance of the later circuit

Images