Microstructural plasma device based on printed circuit board process

Abstract

Disclosed is a microstructural plasma device based on a printed circuit board process. A microcavity of the device is composed of an upper electrode, a middle medium layer and a lower electrode. Each unit of the device is driven by the upper electrode and the lower electrode. A substrate is made of insulating medium epoxy resin materials. Two layers of copper foil are manufactured on the upper surface and the lower surface of the substrate. Certain safe distances are reserved between the edges of the layers of copper foil and the edge of the substrate. The cylindrical microcavity semi-through hole units are arranged in an array mode. Microcavity semi-through holes just penetrate through the upper electrode and do not penetrate through the middle medium layer and the lower electrode. In the array, the distances between rows are not smaller than those between columns. The two layers of copper foil which are separated by the substrate are used as the upper electrode and the lower electrode, the two electrodes are respectively led out of amphenol connectors, and the coplanar-type microstructural plasma device based on the printed circuit board process is obtained.

Description

technical field [0001] The invention relates to a microstructure plasma device based on printed circuit board technology. Background technique [0002] In recent years, as a new type of low-temperature plasma source, micro-discharge plasma has become a hot research topic in the field of low-temperature plasma due to its wide application prospects and the great possibility of opening up many emerging low-temperature plasma basic research fields. one. [0003] The so-called microstructure discharge plasma refers to the plasma whose spatial characteristic scale is limited to the range of submillimeter to micron. It usually results from the miniaturization of conventional plasma devices. Although it is developed from conventional plasma, microdischarge plasma can usually operate under atmospheric pressure because the size of the discharge is reduced to the order of millimeters or even lower. Compared with conventional plasmas, there are some new changes, such as higher plasma...

AI Technical Summary

Problems solved by technology

However, the disadvantage of making microstructure devices in the past is that high-precision processing instruments and advanced technology are required for support.

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