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UV irradiation apparatus and ultraviolet irradiation head

A technology of irradiation device and ultraviolet light, which is applied to electrical components, electric solid-state devices, circuits, etc., can solve the problems of easy deterioration of light-emitting devices and easy heating of UV-LEDs.

Active Publication Date: 2013-12-04
ORMON CORP
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Problems solved by technology

[0007] On the other hand, the UV-LED used to emit ultraviolet light is relatively easy to heat up, and the light-emitting device is easy to deteriorate due to temperature rise

Method used

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  • UV irradiation apparatus and ultraviolet irradiation head
  • UV irradiation apparatus and ultraviolet irradiation head
  • UV irradiation apparatus and ultraviolet irradiation head

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Embodiment Construction

[0032] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, the same reference numerals are assigned to the same components. Their names and functions are the same. Therefore, detailed description of these will not be repeated.

[0033] 1. structure

[0034] figure 1 It is a schematic configuration diagram of the ultraviolet radiation apparatus 100 which concerns on embodiment of this invention.

[0035] 1.1 Structure of the ultraviolet irradiation device 100

[0036] Such as figure 1 As shown, the ultraviolet irradiation device 100 is composed of an ultraviolet irradiation head 2 and a main body 1 . figure 1 shows a UV curable material 24 as an object for irradiating ultraviolet rays. The UV curable material 24 contains monomers, photopolymerization initiators, additives, etc., and starts a polymerization reaction by irradiating ultraviolet rays.

[0037] The ultraviolet irradiation head 2 h...

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Abstract

The present invention relates to an ultraviolet irradiation apparatus and an ultraviolet irradiation head, providing a conductive bonding of the light emitting device in the ultraviolet irradiation apparatus is conducive to miniaturization of the substrate and the irradiation efficiency of the technology. UV irradiation device comprising a conductive substrate and the conductive substrate is bonded to a plurality of ultraviolet light emitting device. Pattern of the present invention, the bonding comprises: a first engagement pattern surface of the member engages the first set of the light emitting device, a first plurality of ultraviolet light-emitting device of at least one light emitting device constituting the ultraviolet light emitting device, the second engagement pattern, and the second group of a plurality of ultraviolet light emitting device constituting the light emitting device is engaged, the second light-emitting devices arranged substantially concentrically surrounding the light emitting device of the first group; the first bonding pattern is used to configure the second set an outer peripheral portion extending substantially concentric region of the light emitting device formed on the surface member.

Description

technical field [0001] The present invention relates to an ultraviolet irradiation device and an ultraviolet irradiation head for irradiating ultraviolet rays, and particularly relates to arranging a plurality of LED (Light Emitting Diode, light emitting diode) light sources in the ultraviolet irradiation head to increase the amount of light. Background technique [0002] Ultraviolet irradiation devices are used in various industrial fields. For example, the ultraviolet irradiation device cures the adhesive or the coating agent by an ultraviolet curing method (Ultra Violet Curing, hereinafter referred to as “UV curing method”). Compared with the thermal curing method using heat energy, the UV curing method has many advantages such as not diffusing harmful substances into the atmosphere, short curing time, and suitable for products that are weak to heat. [0003] The UV curing method refers to a technique in which ultraviolet rays are irradiated to a UV curing material to in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/62H01L25/075
Inventor 芦原克充高仓毅挂谷旭广
Owner ORMON CORP
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