Bonding sheet for manufacturing semiconductor device, semiconductor device and manufacturing method thereof

A manufacturing method, semiconductor technology, applied in the direction of semiconductor/solid-state device manufacturing, semiconductor devices, adhesives, etc., can solve problems such as positioning difficulties, affecting the productivity of semiconductor devices, warpage of lead frames or wiring substrates, etc., to improve productivity and suppress The effect of mold flashing phenomenon

Active Publication Date: 2013-10-23
TOMOEGAWA PAPER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, if such a low-rigidity lead frame or wiring board is subjected to heat treatment for affixing a heat-adhesive adhesive sheet, there is a problem that the lead frame or wiring board is likely to be warped.
If the lead frame or wiring board warps greatly during the bonding process, the positioning in the subsequent die bonding process or wire bonding process will become difficult, which may affect the productivity of semiconductor devices
[0013] For example, according to the invention of Patent Document 1, the mold flashing phenomenon can be suppressed well, but it is not an invention that can sufficiently suppress the warpage that occurs in the lead frame that has become thinner in recent years.

Method used

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  • Bonding sheet for manufacturing semiconductor device, semiconductor device and manufacturing method thereof
  • Bonding sheet for manufacturing semiconductor device, semiconductor device and manufacturing method thereof
  • Bonding sheet for manufacturing semiconductor device, semiconductor device and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～3、 comparative example 1

[0148] According to the composition shown in Table 1, each raw material was dispersed in an appropriate amount of toluene, and a binder coating liquid was prepared respectively.

[0149] Then, a polyimide resin film (manufactured by DuPont Toray, trade name: kapton100EN, thickness 25 μm, glass transition temperature 300° C. or higher, thermal expansion coefficient 16 ppm / ° C.) was prepared as a heat-resistant base material. The above-mentioned adhesive coating solution was coated thereon in such an amount that the thickness after drying was 5 μm. In addition, the size of the adhesive sheet was 60 mm in length and 50 mm in width. After applying the adhesive coating liquid, it was dried at 150° C. for 3 minutes to obtain the adhesive sheet of each example. For the obtained adhesive sheet, the adhesive strength a before heating, the adhesive strength b after heating, the adhesive strength c after heating, the amount of warpage, and the number of resin leaks were measured, and th...

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Abstract

The invention relates to a bonding sheet for manufacturing a semiconductor device, a semiconductor device and a manufacturing method thereof. The bonding sheet for manufacturing the semiconductor device comprises a base material and a thermosetting binder layer arranged on one surface of the base material, and can be pasted on a lead frame (20) or a wiring substrate of a semiconductor device in a strippable manner, the bonding strength a of the binder layer before heating measured in a specific stripping test A is above 0.07N / 20mm, the bonding strength b after heating measured in a specific stripping test B is above 0.58N / 20mm, and the bonding strength c after heating measured in a specific stripping test C is above 1.17N / 20mm.

Description

[0001] Cross References to Related Applications [0002] This application is based on and claims the benefit of priority from Japanese Patent Application Japanese Patent Application No. 2012-70403 filed on March 26, 2012, the entire contents of which are hereby incorporated by reference. technical field [0003] The present invention relates to an adhesive sheet for manufacturing a semiconductor device and a method for manufacturing a semiconductor device. Background technique [0004] In recent years, along with miniaturization and multifunctionalization of electronic equipment such as portable personal computers and mobile phones, high-density mounting technology for electronic components is required in addition to miniaturization and high integration of electronic components constituting the electronic equipment. In this case, surface-mounted semiconductor devices such as CSP (Chip Scale Package: Chip Size Package) that can be mounted at high density replace QFP (Quad Fla...

Claims

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Application Information

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IPC IPC(8): C09J7/02C09J153/02C09J11/06H01L21/603
CPCH01L24/97H01L2224/45144H01L2224/48091H01L2224/48247H01L2924/181H01L2924/00014H01L2924/00H01L2924/00012C09J7/22C09J7/30C09J7/35C09J7/40C09J2203/326C09J2301/304C09J2301/312C09J2301/40
Inventor 春日英昌山井敦史町井悟
Owner TOMOEGAWA PAPER CO LTD
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