A kind of emc package led lead frame deflashing process

A lead frame and anti-overflow technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of damage to epoxy resin and electroplating surface, easy damage to the surface of the plastic body and pins, low cost, etc. The effect of low cost, easy operation and simple method

Active Publication Date: 2016-08-24
NINGBO KANGQIANG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The advantage is that the cost is low, and the disadvantage is that it is easy to damage the surface of the plastic package and the pins, and the epoxy resin and the electroplating surface will be damaged during the deflashing process of the IC package.

Method used

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  • A kind of emc package led lead frame deflashing process

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Embodiment 1

[0020] figure 1 As shown, the LED lead frame of the EMC package of the present invention is composed of a metal frame 1, an epoxy resin 2, and a silver plating layer 3 after half-packaging, but flashes 4 of different degrees will be produced during the production process. The technique of the present invention is to remove the flash 4 without damaging the metal frame 1, the epoxy resin 2, and the silver-plated layer 3. The specific method comprises the following steps: a process for removing flash from an EMC package LED lead frame, characterized in that, The process includes the following steps, 1) electrolysis, 2) air knife, 3) water washing, 4) high-pressure water knife, 5) scrubbing, 6) neutralization, 7) protection, and 8) drying. The main purpose of rinsing in this process is to rinsing the residual overflow, the purpose of neutralization is to neutralize the alkalinity generated during electrolysis, and the purpose of protection is to soak the silver layer protective so...

Embodiment 2

[0022] As a further improvement of the present invention, the high-pressure water knife also includes the following steps, 4.1 Washing with water, continuing to clean the residual overflow, 4.2 Air knife, drying the water and keeping it dry; wherein the function of the high-pressure water knife is to rinse the residual overflow.

Embodiment 3

[0024] As a further improvement of the present invention, the step 5 brushing also includes the following steps, 5.1 washing with water, and continuing to clean the residual overflow, wherein the brushing is mainly to wash away the residual overflow.

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Abstract

The present invention relates to an EMC packaged LED lead frame removal process, characterized in that the process comprises the following steps: 1) electrolysis, 2) air knife, 3) water washing, 4) high-pressure water knife, 5) scrubbing, 6 ) neutralization, 7) protection, 8) drying. Compared with the prior art, the beneficial effects of the present invention are as follows: 1) The whole method is simple, low in cost and easy to operate; 2) This method is more suitable for the characteristics of the LED frame, so that it has the following advantages: washing with water and brushing Combined, the purpose of removing flash is achieved without damaging the product. 3) By increasing the neutralization and protection process, the chemical liquid remaining after electrolysis is neutralized to make its chemical properties stable. After washing with water, it can ensure that the product remains neutral and will not cause discoloration of the silver layer, which is more guaranteed Quality of products.

Description

technical field [0001] The invention relates to a flash removal process, in particular to a flash removal process for an LED lead frame that uses an epoxy resin semi-encapsulation to load a light-emitting chip and adds a semi-transparent plastic package to an EMC package, and belongs to the field of packaging technology. Background technique [0002] The LED lead frame of EMC packaging is the basic material for the production of semiconductor light-emitting elements. Generally, it is composed of copper alloy, electroplating layer, and epoxy resin. The copper alloy is etched to produce a metal strip, and then the electroplating layer and the copper alloy are combined by electroplating. The semi-encapsulation process combines the epoxy resin and the electroplated strip through a mold. After cleaning and removing overflow, it is packaged and stored. The EMC lead frame after epoxy resin encapsulation will produce some overflow phenomenon due to processing methods, mold clearanc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/62H01L33/48
Inventor 曹光伟李泓张继桉
Owner NINGBO KANGQIANG ELECTRONICS CO LTD
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