Electronic equipment with asymmetrical heat dissipation structure

Abstract

The invention provides electronic equipment with an asymmetrical heat dissipation structure, which comprises a PCB (printed circuit board) substrate, a heat conducting metal core installed in the PCB substrate, and a miniature high-power device installed on the heat conducting metal core, wherein the heat conducting metal core comprises a base part and a protruding part extending from the base part, the size of the protruding part corresponds to that of the miniature high-power device, the size of the base part is greater than that of the protruding part, and the miniature high-power device is installed on the protruding part. The electronic equipment provided by the invention realizes effective heat dissipation of the high-power miniature device through the asymmetrical heat conducting metal core installed in a first slot part and a second slot part; the surface area of the PCB substrate is not occupied, an intensive circuit pattern design around the high-power miniature device is not affected, and the flexibility is high; and the effective heat dissipation area of the asymmetrical heat conducting metal core is large, and a function of effective heat dissipation of a partial micro area of the PCB substrate is realized.

Description

technical field [0001] The invention relates to the field of heat dissipation of electronic equipment, in particular to an electronic equipment with an asymmetric heat dissipation structure. Background technique [0002] At present, there is a design for high-end wireless communication in the printed circuit board (PCB) industry: one side of the PCB is designed with miniature high-power devices (≤2mm), and there are denser circuit graphics designs around the devices, which require communication with the inner layer; On the other side of the PCB corresponding to the micro high-power device area, the graphics design density is not high, but heat sinks need to be mounted to dissipate the large amount of heat generated by the micro high-power devices. [0003] The conventional PCB solution is to use heat-conducting plates and dense heat dissipation holes for high-power device areas, but the heat conduction effect of heat-conducting plates and dense heat-dissipating holes is not ...

AI Technical Summary

Problems solved by technology

[0003] The conventional PCB solution is to use heat-conducting plates and dense heat dissipation holes for high-power device areas, but the heat conduction effect of heat-conducting plates and dense heat-dissipating holes is not good, and the dielectric loss coefficient of the plates is large, resulting in poor heat dissipation in the area of ​​micro high-power devices. , Signal transmission loss and distortion are serious, which affects the signal quality of communication products

[0004] Another solution to heat-dissipating PCBs is to use laminated embedding or embedding heat-conducting materials as heat-conducting channels in the high-power device area. Although it can solve the problems of poor heat dissipation and serious signal loss and distortion of conventional heat-conducting PCBs, there are laminations. There are disadvantages such as pre-grooving of multiple sheets / prepregs, oxidation treatment of thermally conductive materials, and difficulty in removing glue stains on the surface of thermally conductive materials after lamination, and the method of laminating and embedding or embedding thermally conductive materials is difficult to manufacture in extremely small sizes (≤2.0mm) thermally conductive material cannot meet the high-efficiency heat dissipation requirements of small areas of the PCB

Images