Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

laser diode device

A technology of laser diodes and assemblies, applied in the direction of lasers, laser components, semiconductor lasers, etc.

Active Publication Date: 2015-09-16
OSRAM OPTO SEMICONDUCTORS GMBH & CO OHG
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, no laser diode manufacturer continues to use this alternative TO housing for nitrogen-based laser diodes

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • laser diode device
  • laser diode device
  • laser diode device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0051] In the exemplary embodiments and figures, identical, similar or identically acting elements can each be provided with the same reference signs. The illustrated elements and their relative size ratios are not considered to be to scale, but rather, for better clarity and / or for better understanding, the various elements, such as layers, components, devices and regions Can be shown exaggeratedly.

[0052] exist Figure 2A , 2B An embodiment for a laser diode device 100 is shown in where, in Figure 2A A schematic cross-sectional view is shown in , and in Figure 2B The reverse of the laser diode device 100 is shown in the Figure 2A A top view of the front side in direction 110 is shown in . The following instructions also refer to Figure 2A and 2B .

[0053] The laser diode arrangement 100 has a housing 1 which is designed in the form of a so-called TO housing. The housing 1 has a housing part 10 and a mounting part 11 arranged on the housing part. The mounting p...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The laser diode device (100) has mounting element (11) that is connected to housing section (10) which is coated with steel. A laser diode chip (2) is provided on the mounting element on a substrate. The substrate is provided with semiconductor layers having active layer for emitting light. The mounting element is provided with base structure made of copper. A solder layer (3) with thickness of not less than 2 mu m is arranged between the chip and mounting element. A crystalline protective layer made of dielectric material is formed on radiation uncoupling surface of the chip.

Description

technical field [0001] The present invention proposes a laser diode device. [0002] Said patent application claims priority from German patent application 102012102305.0, the disclosure of which is incorporated herein by reference. Background technique [0003] A light source with high optical power density is a key component for several applications. For example, laser diodes made of nitrogen-based semiconductor material systems have a high market potential for projection systems, especially such with a luminous flux of between 1000 lumens and 10000 lumens. [0004] Therefore, for such applications, assemblies with high output power and compact housings are necessary. For cost reasons and within the scope of standardization, the housing of the so-called TO structure series (TO: "Transistor Outline") is usually in the form of a TO metal housing ("TO metal can package"), for example in the known structure Forms in sizes TO38, TO56 and TO90, where the TO metal housing is s...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01S5/022H01S5/024H01S5/028
CPCH01S5/0282H01S5/02212H01S5/32341H01S5/02272H01S2301/176H01S5/02476H01S5/02469H01S5/028H01S5/0237
Inventor 艾尔弗雷德·莱尔森克·陶茨乌韦·施特劳斯克莱门斯·菲尔海利希
Owner OSRAM OPTO SEMICONDUCTORS GMBH & CO OHG
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com