Acid bright copper-plating electroplating process
An electroplating process and copper plating technology, applied in the field of acid bright copper electroplating electroplating process, can solve the problems of difficult processing, increased coating thickness, short service life, etc., and achieve the effect of smooth surface of workpiece and uniform coating
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0032] Embodiment 1: a kind of acid bright copper plating electroplating process, comprises the preparation of copper plating solution, workpiece pretreatment and acid bright copper plating, and the concrete steps of this process are as follows:
[0033] (1) Preparation of copper plating solution
[0034] Raw material ratio of copper plating solution is 2 m 3 Based on deionized water, copper sulfate is 400kg, sulfuric acid is 160kg, activated carbon is 5kg, hydrochloric acid is 150g, brightener A is 15L and brightener B is 1.6L;
[0035] The specific configuration method is as follows:
[0036] a. Under stirring, mix 2 m 3 Deionized water injection 3 m 3 in the pre-used slot;
[0037] b. under stirring, add 160kg of sulfuric acid in step a, control the solution temperature in the pre-use tank at 33°C;
[0038] c. under stirring, add 400kg copper sulfate in step b, stir until completely dissolving;
[0039] d. Under stirring, sprinkle 5kg of activated carbon evenly into s...
Embodiment 2
[0046] Embodiment 2: a kind of acid bright copper plating electroplating process comprises the preparation of copper plating solution, workpiece pretreatment and acid bright copper plating, and the concrete steps of this process are as follows:
[0047] (1) Preparation of copper plating solution
[0048] Raw material ratio of copper plating solution is 2 m 3 Based on deionized water, copper sulfate is 360kg, sulfuric acid is 180kg, activated carbon is 6kg, hydrochloric acid is 120g, brightener A is 14L and brightener B is 1.5L;
[0049] The specific configuration method is as follows:
[0050] a. Under stirring, mix 2 m 3 Deionized water injection 3 m 3 in the pre-used slot;
[0051] b. under stirring, add 180kg of sulfuric acid in step a, control the solution temperature in the pre-use tank at 35°C;
[0052] c. under stirring, add 360kg copper sulfate in step b, stir until completely dissolving;
[0053] d. Under stirring, sprinkle 6kg of activated carbon evenly into step...
Embodiment 3
[0060] Embodiment 3: a kind of acid bright copper-plating electroplating process, comprises the preparation of copper-plating solution, workpiece pretreatment and acid bright copper-plating, and the concrete steps of this process are as follows:
[0061] (1) Preparation of copper plating solution
[0062] Raw material ratio of copper plating solution is 2 m 3 Based on deionized water, copper sulfate is 420kg, sulfuric acid is 160kg, activated carbon is 5kg, hydrochloric acid is 130g, brightener A is 16L and brightener B is 1.8L;
[0063] The specific configuration method is as follows:
[0064] a. Under stirring, mix 2 m 3 Deionized water injection 3 m 3 in the pre-used slot;
[0065] b. under stirring, add 160kg of sulfuric acid in step a, control the solution temperature in the pre-use tank at 36°C;
[0066] c. under stirring, add 420kg copper sulfate in step b, stir until completely dissolving;
[0067] d. Under stirring, sprinkle 5kg of activated carbon evenly into s...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com