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Wafer copper film thickness off-line measuring module control system

An offline measurement and control system technology, applied in special data processing applications, instruments, electrical digital data processing, etc., can solve problems such as lack of high-performance drawing operations and can not well meet the needs of offline measurement module drawing functions, etc. Achieving good visualization and easy operation

Active Publication Date: 2013-08-28
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the lack of high-performance drawing operations in Qt, it cannot well meet the needs of the drawing function of the offline measurement module, so other tools are needed

Method used

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  • Wafer copper film thickness off-line measuring module control system
  • Wafer copper film thickness off-line measuring module control system
  • Wafer copper film thickness off-line measuring module control system

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Embodiment Construction

[0031] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0032] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation or position indicated by "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. The relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the descrip...

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PUM

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Abstract

The invention discloses a wafer copper film thickness off-line measuring module control system which adopts a two-level control module of an upper layer control system and a bottom layer control system. The upper layer control system and the bottom layer control system are in physical connection through industrial Ethernet. According to the bottom layer control system, a PLC is adopted to be in charge of directly controlling all parts of an off-line measuring module. According to the upper layer control system, an IPC is adopted to monitor the states of the off-line measuring module in real time through the PLC, operational software is provided for a technologist, and managing of data is achieved. According to the technological requirements, two main measurement patterns including an XY pattern and a global pattern are set. The technological procedures are divided into the standardization process and the measurement process. According to the upper layer control system software, a drawing subprogram is achieved through Matlab, and the drawing subprogram is called flexibly through a main program. The wafer copper film thickness off-line measuring module control system has the advantages of being lossless in test, easy to operate, convenient to maintain, safe and reliable.

Description

technical field [0001] The invention relates to the technical field of chemical mechanical polishing, in particular to an off-line measurement module control system for wafer copper film thickness. Background technique [0002] Chemical Mechanical Polishing (CMP) technology is one of the key technologies for preparing multilayer copper interconnection structures in integrated circuit (Integrated Circuit, IC) manufacturing. In the manufacturing process of integrated circuits, not only local planarization but also global planarization must be realized. Traditional planarization techniques are limited to local planarization and cannot meet the requirements of global planarization. As the most effective global planarization method today, CMP technology can effectively take into account the local and global flatness of the wafer, and has been widely used in the manufacture of VLSI. [0003] This CMP system is designed for copper CMP process to remove excess copper on the wafer ...

Claims

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Application Information

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IPC IPC(8): G06F17/50
Inventor 路新春李弘恺余强田芳馨赵德文赵乾孟永钢
Owner TSINGHUA UNIV
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