Slurry management device for wire saw

Abstract

A wire saw slurry management device is provided with: a first tank (5A) which receives slurry waste (3); a centrifugal separator (14) into which the slurry waste (3b) from the first tank (5A) is introduced and which isolates the slurry (2); a second tank (5B) which receives the solid-content slurry (2) from the centrifugal separator (14); a slurry supply path (26) which supplies the slurry (2) from the second tank (5B) to a fixed-abrasive wire saw (1); a controller (41) which detects the slurry density using a detection value from a density meter (29) and a viscometer (30), both provided on a circulation flow path (28) for extracting and circulating the slurry (2) from the second tank (5B); a slurry discharge path (33) which discharges some of the slurry (2) from the second tank (5B) as waste slurry (31); and a new slurry supply path (38) which supplies new slurry (2a) to the second tank (5B). The discharge of waste slurry (31) by the slurry discharge path (33) and the supply of new slurry (2a) by the new slurry supply path (38) are implemented in order to maintain a specific density for the slurry density detected using the controller (41).

Description

technical field [0001] The present invention relates to a slurry management device for a wire saw that is easy to adjust the slurry supplied to a fixed abrasive wire saw and can achieve stable cutting. Background technique [0002] Conventionally, a wire saw has been used as an apparatus for cutting a workpiece to be cut (for example, a silicon ingot) to form a wafer. In this wire saw, there is a free abrasive wire saw in which a tensioned thin metal wire row is advanced, and a material to be cut is pushed against the metal wire row while spraying slurry on the metal wire row. In this way, the object to be cut is simultaneously cut into a plurality of wafers, and the slurry contains abrasive grains for cutting in the coolant for removing cutting heat (for example, refer to Patent Document 1). [0003] In addition, in recent years, there has been a fixed abrasive wire saw that uses a fixed abrasive wire array in which diamond abrasive grains and the like are previously attac...

AI Technical Summary

Problems solved by technology

Here, in the case of continuous separation, it is necessary to continuously extract the slurry waste liquid, monitor the extraction amount and the respective recovery amount, and carry out recovery of abrasive grains, disposal of chips, and exchange of new coolant and new abrasive grains. Complicated operations such as blending and return of regenerated pulp are difficult to manage

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