Resin molded product and process for producing same, resin composition and process for producing same, and electronic component device

A technology of resin molding and resin composition, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device parts, electrical components, etc., can solve problems such as impracticality, reduce storage costs and transportation costs, and improve long-term Effects on storage stability

Active Publication Date: 2013-07-31
SUMITOMO BAKELITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this meant that new equipment had to be introduced
Therefore, the method is impractical

Method used

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  • Resin molded product and process for producing same, resin composition and process for producing same, and electronic component device
  • Resin molded product and process for producing same, resin composition and process for producing same, and electronic component device
  • Resin molded product and process for producing same, resin composition and process for producing same, and electronic component device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0136] Hereinafter, although a description is given of embodiments (examples) of the present invention, the present invention is not limited thereto. In the following table, the value "composition ratio" described in the column is expressed in parts by weight.

[0137] A description will be given of raw materials used in Examples and Comparative Examples. Unless otherwise specified, each of the raw material, the first powder material, and the second powder material was measured using a laser-type particle size analyzer (SALD-7000 manufactured by Shimadzu Corporation) under the condition that the refractive index D was 1.70 to 1.00i particle size distribution.

[0138] (epoxy resin)

[0139] Epoxy resin 1: Epoxy resin 1 is a phenol aralkyl type epoxy resin having a biphenylene structure (by using a sample mill K manufactured by Fujipaudal Corporation II W-1. NC-3000 manufactured by Nipponkayaku Corporation finely pulverizes a phenol aralkyl type epoxy resin. The epoxy equiv...

Embodiment 1

[0164] Preparation of No. A powder material. Table 1 shows the median diameter of the prepared first powder material and the ratio of the amount of large-sized particles with a diameter equal to or greater than 500 μm relative to the total amount of particles of the prepared first powder material. Then, a resin composition was prepared by adding curing accelerator 2 to the prepared first powder material and performing dispersion and mixing for five minutes by using a propeller type mixer. Then, a resin sheet was obtained by molding the prepared resin composition into a sheet shape using a tablet machine (S-20A manufactured by Mitsubishi materials techno Corporation) under a pressure of 2 MPa. The obtained resin sheet had a degree of compression of 91%, a diameter of 18 mm, a height of 31.6 mm and a weight of 14.5 g. Table 1 shows the maximum temperature of the resin composition during dispersion and mixing and the maximum temperature of the resin sheet during molding of the ...

Embodiment 2

[0166] By mixing each of the components described in Table 1 below except curing accelerator 3 by using a propeller type mixer at room temperature, the mixture was melted and melted by using a heated drum at a temperature of 80° C. to 100° C. kneading, and then pulverizing the heated mixture using a pulverizer to prepare a first powder material. Table 1 shows the median diameter of the prepared first powder material and the ratio of the amount of large-sized particles with a diameter equal to or greater than 500 μm relative to the total amount of particles of the prepared first powder material. Then, a resin composition was prepared by adding curing accelerator 3 to the prepared first powder material and performing dispersion and mixing for five minutes by using a propeller type mixer. Then, a resin sheet was obtained by molding the prepared resin composition into a sheet shape using a tablet machine (S-20A manufactured by Mitsubishi materials techno Corporation) under a press...

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Abstract

A process for producing a resin molded product according to the present invention is a process for producing a resin molded product that is made of a resin composition containing an epoxy resin, a curing agent, a curing accelerator, and an inorganic filler, the process involving: a kneading and crushing step of preparing a first powder by mixing, heating and melting, kneading, and crushing a first component that contains an epoxy resin, a curing agent, and an inorganic filler and that does not contain a curing accelerator; a pulverizing step of preparing a second powder by pulverizing a second component containing a curing accelerator; a mixing step of preparing a resin composition by dispersing and mixing the first powder and the second powder; and a molding step of molding a resin molded product by pressurizing the resin composition. Thus, it is possible to produce a resin molded product (particularly, resin tablets for sealing) having excellent long-term storability at room temperature and excellent curability and flowability.

Description

technical field [0001] The present invention relates to a resin molded body, a method for producing the resin molded body, a resin composition, a method for producing the resin composition, and an electronic component device, and more particularly relates to a resin having excellent long-term storage stability at room temperature A resin molded body with good curability and fluidity, a method for manufacturing the resin molded body, a resin composition for manufacturing the resin molded body, and a method for manufacturing the resin composition. Background technique [0002] Electronic devices such as ICs, LSIs, or discrete semiconductors are encapsulated using epoxy resins mainly by transfer molding. Transfer molding is generally used for such packages because transfer molding is superior in cost performance, reliability, and productivity. In most of the transfer molding methods, generally, an epoxy resin composition (resin molded body) in a tablet shape is molded by putti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J3/20B29B9/08C08G59/68H01L21/56H01L23/29H01L23/31B29K63/00
CPCH01L23/293B29B7/002H01L23/296B29C43/02C08G59/40C08G59/68H01L23/295H01L2924/0002H01L2924/00C08J3/20C08J2363/00
Inventor 高桥良幸宇津木洋志
Owner SUMITOMO BAKELITE CO LTD
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