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Preparation method of nickel-cubic boron nitride film

A technology of cubic boron nitride and boron nitride powder, applied in coatings, electrolytic coatings, etc., can solve the problems of low content of cubic boron nitride and uneven distribution of cubic boron nitride particles, and achieve uniform distribution and firm inlay. Effect

Inactive Publication Date: 2013-07-17
HENAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problems of low cubic boron nitride content and uneven distribution of cubic boron nitride particles in the nickel-cubic boron nitride film prepared by the existing method, the invention provides a preparation method of the nickel-cubic boron nitride film, It can effectively increase the content of cubic boron nitride in nickel-cubic boron nitride film, which not only improves the distribution of cubic boron nitride particles in the film, but also improves the bonding strength between the film and the substrate

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A kind of preparation method of nickel-cubic boron nitride film, comprises the following steps:

[0028] 1. Preparation of plating solution

[0029] 1) Weigh 30g of boric acid, 5g of ammonium chloride, 280g of nickel sulfamate and 0.6g of sodium lauryl sulfate, and dissolve the weighed substances in appropriate amount of deionized water to prepare a solution for later use;

[0030] 2) Add the sodium lauryl sulfate solution, nickel sulfamate solution and ammonium chloride solution prepared in step 1) into the boric acid solution while stirring, and set aside;

[0031] 3) Add deionized water to the mixed solution prepared in step 2) to make the volume of the mixed solution reach 1L, mix well to prepare the plating solution;

[0032] 2. Electroplating

[0033] 4) First add 25g of degreased and oil-treated cubic boron nitride powder to the plating solution prepared in step 3), then put the treated cathode substrate and anode nickel plate into the plating solution for elec...

Embodiment 2

[0036] A kind of preparation method of nickel-cubic boron nitride film, comprises the following steps:

[0037] 1. Preparation of plating solution

[0038] 1) Weigh 50g of boric acid, 15g of ammonium chloride, 320g of nickel sulfamate and 1.0g of sodium lauryl sulfate, and dissolve the weighed substances in appropriate amount of deionized water to prepare a solution for later use;

[0039]2) Add the sodium lauryl sulfate solution, nickel sulfamate solution and ammonium chloride solution prepared in step 1) into the boric acid solution while stirring, and set aside;

[0040] 3) Add deionized water to the mixed solution prepared in step 2) to make the volume of the mixed solution reach 1L, mix well to prepare the plating solution;

[0041] 2. Electroplating

[0042] 4) First add 45g of degreasing and degreasing cubic boron nitride powder to the plating solution prepared in step 3), then put the treated cathode substrate and anode nickel plate into the plating solution for elec...

Embodiment 3

[0045] A kind of preparation method of nickel-cubic boron nitride film, comprises the following steps:

[0046] 1. Preparation of plating solution

[0047] 1) Weigh 40g of boric acid, 10g of ammonium chloride, 300g of nickel sulfamate and 0.8g of sodium lauryl sulfate, respectively, and dissolve each of the weighed substances in an appropriate amount of deionized water to prepare a solution for later use;

[0048] 2) Add the sodium lauryl sulfate solution, nickel sulfamate solution and ammonium chloride solution prepared in step 1) into the boric acid solution while stirring, and set aside;

[0049] 3) Add deionized water to the mixed solution prepared in step 2) to make the volume of the mixed solution reach 1L, mix well to prepare the plating solution;

[0050] 2. Electroplating

[0051] 4) First add 35g of degreasing and degreasing cubic boron nitride powder to the plating solution prepared in step 3), then put the treated cathode substrate and anode nickel plate into the...

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PUM

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Abstract

The invention relates to a preparation method of a nickel-cubic boron nitride film. The method comprises the following steps of: firstly cleaning anode / cathode base materials and cubic boron nitride powder; putting the treated anode / cathode base materials and cubic boron nitride powder into a plating solution and electroplating, wherein the plating solution is formed by dissolving boric acid, ammonium chloride, nickel aminosulfonate and a lauryl sodium sulfate solution in deionized water; and applying an ultrasonic wave with the power of 250 to 260W and the frequency of 20 to 40KHz to the plating solution during the electroplating process. By leading the ultrasonic wave into the electroplating process and optimizing the formula and the process parameters of the plating solution, the cubic boron nitride powder in the plating layer of the nickel-cubic boron nitride film generated in the electroplating manner is distributed uniformly and is not agglomerated. In addition, the nickel layer in the film is flat relatively; and the cubic boron nitride powder is not agglomerated in the film and is firmly embedded.

Description

technical field [0001] The invention relates to the field of preparation of nickel-cubic boron nitride thin films, in particular to a preparation method of nickel-cubic boron nitride thin films. Background technique [0002] Cubic boron nitride (cBN) is a new type of semiconductor material with excellent physical and chemical properties, such as high hardness, high thermal conductivity, wide band gap, high thermal stability and chemical stability, suitable for use as iron-based alloy tool coating . [0003] The typical physical vapor deposition methods for preparing cubic boron nitride thin films mainly include sputtering, ion plating and pulsed laser deposition, and the main chemical methods include radio frequency glow discharge plasma CVD, hot wire assisted radio frequency glow discharge plasma CVD, electron cyclotron resonance CVD, etc. Scientific researchers have used various physical vapor deposition and chemical deposition methods to prepare cubic boron nitride thin...

Claims

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Application Information

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IPC IPC(8): C25D15/00C25D3/12C25D5/20
Inventor 姚怀刘雅琴刘伟苌清华杜三明
Owner HENAN UNIV OF SCI & TECH
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