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A production process for a step stencil

A template and step technology, which is applied to the mixed preparation process of printing mask plates, the step template and its mixed preparation technology field, can solve the problems of less and difficult to remove slag, etc., and achieves good opening quality, good thickness uniformity, and holes. smooth wall effect

Inactive Publication Date: 2013-07-17
KUN SHAN POWER STENCIL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

While there is a major problem with metal dross (evaporated molten metal) from laser beams, modern laser cutters produce very little dross that is not easy to remove

Method used

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  • A production process for a step stencil
  • A production process for a step stencil
  • A production process for a step stencil

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Embodiment Construction

[0077] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0078] The specific technological process of this legal name and the attention problem in technological process among the present invention will be more detailed in the following narration.

[0079] A step template, characterized in that the PCB surface of the template has an up step step feature ( figure 1 ).

[0080] This kind of step template is prepared by a mixed preparation process, including three processes of etching, laser cutting and electropolishing. The specific process is as follows:

[0081] (1) Fabrication of the raised ...

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Abstract

A step stencil and a hybrid production process thereof. The step stencil is a metal mask having up steps on a PCB surface, and the base material of the mask is one of stainless steel, pure nickel and a nickel-iron alloy. The hybrid production process flow is as follows: (1) the fabrication of the up step area on the stencil PCB surface; (2) the fabrication of a half-etched blind hole of the stencil; (3) the fabrication of stencil openings; and (4) subsequent processing of the stencil openings. The hybrid production process includes three processes of etching, laser cutting and electropolishing, by using which the metal stencil having the PCB surface with up step can be produced. Through the fabrication of the half-etched blind holes, alignment holes for precise alignment can be produced; the metal screen has an opening pattern both in the flat area and the up step area; and the opening has good quality, smooth hole walls, and no blurs; by using the etching process, the stencil surface can be made to be flat and no-tilting phenomenon; and the flat area of the metal stencil has good thickness uniformity.

Description

[0001] technical field [0002] The invention relates to a step template and a mixed preparation process thereof, belonging to the field of material manufacturing and processing, in particular to a mixed preparation process of a printing mask with raised steps (up steps) on the PCB surface in the SMT field. [0003] Background technique [0004] With the pursuit of miniaturization of electronic products, the perforated plug-in components used before can no longer be reduced; the functions of electronic products are more complete, and the integrated circuits (ICs) used can no longer perforate components, especially large-scale and highly integrated ICs, which have to use surface SMT components, so the stencil printing process has developed rapidly in the electronics manufacturing industry, and SMT printing is a typical example. The procurement of templates is not only the first step in the SMT assembly process, it is also the most important step. The main function of the st...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41C1/14
Inventor 魏志凌高小平吴建
Owner KUN SHAN POWER STENCIL
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