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Method for processing precise light sensitive hole through ultrasonic laser processing and laser equipment

An ultraviolet laser and processing method technology, applied in laser welding equipment, metal processing equipment, welding equipment and other directions, can solve the problems of complicated silk screen processing hole process, poor light transmission effect, large aperture of photosensitive hole and so on

Active Publication Date: 2020-06-02
HANS LASER TECH IND GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a processing method for processing precision photosensitive holes by ultraviolet laser, so as to overcome the problems of complicated silk screen processing hole technology, large aperture and poor light transmission effect of the processed photosensitive holes

Method used

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  • Method for processing precise light sensitive hole through ultrasonic laser processing and laser equipment
  • Method for processing precise light sensitive hole through ultrasonic laser processing and laser equipment
  • Method for processing precise light sensitive hole through ultrasonic laser processing and laser equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0111] Processed piece: mobile phone glass panel with a thickness of 0.8mm, its surface ink thickness is 0.03mm, the diameter of the processed hole is set to 0.03mm, the number is 700 (circular array), and the distance between adjacent processed holes is 0.1mm.

[0112] The operation steps for ultra-violet laser efficient processing of precision photosensitive holes are as follows:

[0113] (1) Workpiece clamping and positioning

[0114] Check whether the tolerance size of the jig position meets the production tolerance, decide whether to add a CCD capture and positioning device, and clamp the workpiece flat on the jig.

[0115] (2) Processing graphics processing

[0116] According to the processing requirements, the graphic files of the processed holes should be processed. The graphic design of the micro-holes should have a diameter of 20 μm, a hole spacing of 90 μm, and a circular array of micro-holes, and generate corresponding files.

[0117] (3) Import the processing m...

Embodiment 2

[0123] Processed piece: mobile phone glass panel with a thickness of 0.6mm, the surface ink thickness is 0.02mm, the diameter of the processed hole is set to 0.02mm, the number is 900 (circular array), and the distance between adjacent processed holes is 0.08mm.

[0124] The operation steps for ultra-violet laser efficient processing of precision photosensitive holes are as follows:

[0125] (1) Workpiece clamping and positioning

[0126] Check whether the tolerance size of the jig position meets the production tolerance, decide whether to add a CCD capture and positioning device, and clamp the workpiece flat on the jig.

[0127] (2) Processing graphics processing

[0128] According to the processing requirements, process the graphic files of the processed holes. The graphic design aperture of the micro-holes should be 15 μm, the hole spacing should be 50 μm, and the micro-holes are in a circular array, and the corresponding files are generated.

[0129] (3) Import the proc...

Embodiment 3

[0135] Processed piece: mobile phone glass panel with a thickness of 0.5mm, the surface ink thickness is 0.02mm, the diameter of the processed hole is set to 0.02mm, the number is 1000 (rectangular array), and the distance between adjacent processed holes is 0.08mm.

[0136] The operation steps for ultra-violet laser efficient processing of precision photosensitive holes are as follows:

[0137] (1) Workpiece clamping and positioning

[0138] Check whether the tolerance size of the jig position meets the production tolerance, decide whether to add a CCD capture and positioning device, and clamp the workpiece flat on the jig.

[0139] (2) Processing graphics processing

[0140] According to the processing requirements, process the graphic files of the processed holes. The graphic design aperture of the micro-holes should be 15 μm, the hole spacing should be 50 μm, and the micro-holes are in a circular array, and the corresponding files are generated.

[0141] (3) Import the ...

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Abstract

The invention relates to the technical field of laser processing and provides a method for processing a precise light sensitive hole through ultrasonic laser processing. The method comprises the following steps of preparing a workpiece to be processed and spraying printing ink on the surface of the workpiece to be processed; setting a drawing file of the light sensitive hole to be processed according to the processing requirements; importing the set drawing file of the light sensitive hole into laser equipment; controlling a laser beam emitted from the laser equipment to be projected onto thesurface of the workpiece to be processed through an optical system, and carrying out gasification treatment on an ink layer on the surface of the workpiece to be processed according to the preset drawing file to form the precise light sensitive hole; and taking out the processed workpiece with the formed light sensitive hole from the laser equipment. The method is simple in process. The aperture of the processed light sensitive hole is small and can reach up to 0.02 mm or less. The light sensitive hole is good in consistency, smooth in edge, free of burrs, high in roundness, free of overflow plating and good in light transmitting effect.

Description

【Technical field】 [0001] The invention relates to the technical field of laser processing, in particular to a processing method and laser equipment for processing precision photosensitive holes by ultraviolet laser. 【Background technique】 [0002] The photosensitive holes on the cover plates of various mobile phones and tablet products are usually processed by masking silk screen printing. Silk screen printing is screen printing. The screen holes of the graphic part are through holes, and the screen holes of the non-graphic part are blocked, and then the ink is transferred to the substrate through the mesh of the graphic part through the extrusion of the scraper during printing, forming The same graphics and text as the original. Although silk screen printing has the advantages of simple process, low cost, and is suitable for mass production, the precision of the current products is getting higher and higher, and the requirements for holes are also higher. Some products req...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/382B23K26/70
CPCB23K26/382B23K26/702
Inventor 龙明昇胡述旭曹洪涛吕启涛陈上杭黄柏元高云峰
Owner HANS LASER TECH IND GRP CO LTD
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